Method of manufacturing a printed circuit board assembly

A circuit board arrangement comprising:

• a plurality of electrical modules, wherein each electrical module of the plurality of electrical modules comprises a ceramic substrate and an electrical component arranged on the ceramic substrate;
• a first board having an upper side and a lower side, wherein the electrical components of the plurality of electrical modules and electrical contacts assigned thereto are integrated, wherein the assigned electrical contacts comprise upper first contact surfaces on the upper side of the first board and lower second contact surfaces on the lower side of the first board;
• a second board having an upper side and a lower side, wherein the ceramic substrates of the plurality of electrical modules are integrated, wherein the ceramic substrates comprise upper third contact surfaces on the upper side of the second board;
• and
• a multi-layered circuit board comprising a lower side that provides lower fourth contact surfaces,
• wherein the upper side of the first board is connected to the lower side of the multi-layered circuit board and the upper side of the second board is connected to the lower side of the first board,
• wherein an arrangement of the plurality of electrical modules are connected on the lower side of the multi-layered circuit board,
• wherein the upper first contact surfaces of the first board are connected to the lower fourth contact surfaces of the lower side of the multi-layered circuit board a first sintering layer, and
• wherein the lower second contact surfaces of the first board are connected to the upper third contact surfaces of the second board by a second sintering layer.

A circuit board arrangement comprising:

• a circuit board;
• and
• a plurality of electrical modules connected to the circuit board, wherein each electrical module comprises a ceramic substrate and an electrical component arranged on the ceramic substrate,
• wherein the plurality of electrical modules is formed without isolation in a board,
• wherein the board as a whole is connected to the circuit board, and
• wherein contact surfaces, which are assigned to one another, of the plurality of electrical modules and the circuit board are each connected to one another via a sintering layer.