Microetching composition for copper or copper alloy
AssigneeMec Company Ltd.
InventorsYoshiro Maki, Toshiko Nakagawa, Yasushi Yamada, Takashi Haruta, Maki Arimura
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Abstract
A microetching composition for copper or copper alloys comprising, (a) an oxidizing agent which can oxidize the copper or copper alloy, (b) a polymer compound which contains polyamine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight, and (c) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists, and superior solderability. The composition can be adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.
Claims15
A microetching composition for copper or copper alloys comprising:
- (a) an oxidizing agent which can oxidize the copper or copper alloy and is selected from cupric ion source compounds,
- (b) an organic acid or an inorganic acid,
- (c) a halide ion source compound,
- (d) a polymer compound having a molecular weight of at least 1,000 which contains polyamine or polyimine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight, and
- (e) water.
Dependencies are inferred from the claim text.