H05K 2203/074
Features related to the fluid pressure
H05K2203/074 (Features related to the fluid pressure) appears on 38 US grants and 34 published applications in this corpus.
Search patents in H05K- Granted patents
- 38
- Published applications
- 34
- Assignees
- 32
- Inventors
- 110
- Latest grant
- 1 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 2 | 3 |
| 2003 | 1 | 1 |
| 2004 | 2 | 3 |
| 2005 | 0 | 0 |
| 2006 | 1 | 2 |
| 2007 | 0 | 2 |
| 2008 | 0 | 4 |
| 2009 | 0 | 5 |
| 2010 | 4 | 3 |
| 2011 | 2 | 2 |
| 2012 | 1 | 2 |
| 2013 | 3 | 0 |
| 2014 | 2 | 0 |
| 2015 | 2 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 1 | 2 |
| 2019 | 0 | 0 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 2 | 2 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Recyclable electronic device1 Jul 2025US 12,349,286 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Automated pressure control system and method for a cleaner7 May 2024US 11,975,343 B1Illinois Tool Works Inc.
- Circuit board and component fabrication apparatus5 Mar 2024US 11,919,227 B2DST Innovations Limited
- Structure, wiring board, substrate for wiring board, copper clad laminate, and method for manufacturing the structure2 Feb 2021US 10,912,193 B2Kabushiki Kaisha Toshiba
- Fluid discharge device, fluid discharge method, and fluid application device28 Apr 2020US 10,632,492 B2Senju Metal Industry Co., Ltd.
- Wiring harness production method, nozzle, and wiring harness2 Jan 2025US 2025/0006407 A1Changchun Jetty Automotive Technology Co., Ltd.
- Design of a recyclable electronic device26 Dec 2024US 2024/0431037 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Automated pressure control system and method for a cleaner2 May 2024US 2024/0139764 A1Illinois Tool Works Inc.
- Structure, wiring board, substrate for wiring board, copper clad laminate, and method for manufacturing the structure2 Jul 2020US 2020/0214126 A1Kabushiki Kaisha Toshiba
- A Circuit Board and Component Fabrication Apparatus7 Jun 2018US 2018/0154573 A1DST Innovations Limited
Most cited
By later US patents
- Intaglio printing method, intaglio printer, method of formation of bumps or wiring pattern, apparatus therefor, bump electrode and printed circuit board34US 6,109,175 ARicoh Microelectronics Co., Ltd. · 2000
- Method of forming connector structure for a ball-grid array34US 6,199,273 B1Sumitomo Metal Industries, Ltd. · 2001
- Laser piercing of materials by induced shock waves28US 4,115,683 AInternational Business Machines Corporation · 1978
- Low temperature solder column attach by injection molded solder and structure formed28US 6,276,596 B1International Business Machines Corporation · 2001
- Microelectronic packages with solder interconnections19US 6,335,222 B12002