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AssigneesSumitomo Metal Industries, Ltd., Sumitomo Metal (SMI) Electronics Devices Inc.
InventorsToshihiko Kubo, Takuji Ito, Hiroshi Takamichi, Akihiro Hidaka
Estimating the term…
A ball-grid array connector structure for an electronic package in which the ball pitch can be reduced to increase the packaging density has a plastic substrate having at least one hollow through-hole and an electrode covering the wall of the through-hole and forming an electrode pad surrounding the through-hole on each surface of the substrate. A metallic ball is joined, either directly or through a solder or a combination of a metallic bump and a solder, to the electrode pad on at least one surface of the substrate at the position of the through-hole. The connector structure can be formed either by sealing an open end of the through-hole on the side to which the ball is not joined, or increasing the pressure within the through-hole by a pressure-control mechanism, before the through-hole is blocked by reflowing the ball itself or the metallic bump or solder used to connect the ball.
A method for forming a connector structure of a ball-grid array (BGA) type in an electronic package having at least one hollow through-hole, comprising at least one metallic ball joined to an electrode of the package at the position of the through-hole on at least one surface of the package, comprising joining the metallic ball to the electrode of the package at the position of the through-hole, the metallic ball being a solder ball which is joined to the electrode by reflowing the solder ball while pressure within the through-hole is controlled.
A method for forming a connector structure of a ball-grid array (BGA) type in an electronic package having at least one hollow through-hole, comprising at least one metallic ball joined to an electrode of the package at the position of the through-hole on at least one surface of the package, comprising joining the metallic ball to the electrode of the package at the position of the through-hole, the metallic ball being joined to the electrode of the package through solder, the method including melting the solder to join the metallic ball to the electrode through the solder at the position of the through-hole while pressure within the through-hole is controlled.
A method for forming a connector structure of a ball-grid array (BGA) type in an electronic package having at least one hollow through-hole, comprising at least one metallic ball joined to an electrode of the package at the position of the through-hole on at least one surface of the package, comprising joining the metallic ball to the electrode of the package at the position of the through-hole, the metallic ball being joined to the electrode of the package through a metallic bump and solder, the method including melt-forming the metallic bump on the electrode of the package at the position of the through-hole while pressure within the through-hole is controlled.
Dependencies are inferred from the claim text.