Microelectronic packages with solder interconnections

Abstract

A soldered assembly such as a packaged semiconductor chip includes elongated solder columns connected to the pads on the chip and a dielectric sheet having pads connected to the distal ends of the solder columns remote from the chip. Terminals on the sheet are connected to the pads of the sheet. The assembly can be handled and mounted using conventional surface-mount techniques, but provides thermal fatigue resistance. The solder columns may be inclined relative to the chip surface, and may contain long, columnar inclusions preferentially oriented along the lengthwise axes of the columns.

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