Intaglio printing method, intaglio printer, method of formation of bumps or wiring pattern, apparatus therefor, bump electrode and printed circuit board

An intaglio printer capable of (a) bringing an intaglio printing master having portions depressed in a printing shape below the surface of said printing master, in which depressed portions a paste or a fused metal is filled, into close contact with a print receiving material which can receive said paste or said fused metal, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal to said print receiving material, comprising;

• (1) an airtight housing for holding therein said paste or said fused metal, provided with a vacant space therein,
• (2) means for decreasing or increasing the pressure in said vacant space of said airtight housing,
• (3) a shielding plate which can be brought into close and sliding contact with the surface of said printing master which is immersed in said paste or said fused metal to remove said paste or said fused metal therefrom and to close the openings of said depressed portions in which said paste or said fused metal is filled,
• (4) means for immersing said intaglio printing master having portions depressed in said printing shape below the surface of said printing master in said paste or said fused metal which is placed in said airtight housing, to fill said depressed portions with said paste or said fused metal,
• (5) means for bringing said shielding plate into close and sliding contact with the surface of said printing master, thereby removing said paste or said fused metal therefrom and closing the openings of said depressed portions in which said paste or said fused metal is filled, with said shielding plate,
• (6) means for taking out said printing master to which said shielding plate is closely attached from said paste or said fused metal,
• (7) means for separating said shielding plate from the surface of said printing master,
• (8) means for bringing said printing master free of said shielding plate into close contact with said print receiving material, and
• (9) means for separating said printing master from said print receiving material to transfer said paste or said fused metal in said printing shape to said print receiving material.

A method of forming bumps on a substrate, using an intaglio printing master having bump female die portions in a printing shape depressed below the surface of said printing master, by an intaglio printing method comprising the steps of (a) bringing said intaglio printing master, with a paste or a fused metal being filled in said bump female die portions, into close contact with a print receiving material which can receive said paste or said fused metal, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal to said print receiving material, wherein said intaglio printing method further comprises the steps of:

• (1) immersing said intaglio printing master having said bump female die portions in said printing shape in said paste or said fused metal to fill said bump female die portions with said paste or said fused metal,
• (2) bringing a shielding plate into close and sliding contact with the surface of said printing master to remove said paste or said fused metal therefrom and to close the openings of said bump female die portions in which said paste or said fused metal is filled, with said shielding plate,
• (3) taking out said printing master to which said shielding plate is closely attached from said paste or said fused metal,
• (4) separating said shielding plate from the surface of said printing master,
• (5) bringing said printing master free of said shielding plate into close contact with said print receiving material, and
• (6) separating said printing master from said print receiving material to transfer said paste or said fused metal in said printing shape to said print receiving material.

A method of forming a wiring pattern on a substrate, using an intaglio printing master having groove portions depressed below the surface of said printing master, in a printing shape corresponding to said wiring pattern, by an intaglio printing method comprising the steps of (a) bringing said intaglio printing master, with a paste or a fused metal being filled in said groove portions, into close contact with a print receiving material which can receive said paste or said fused metal, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal to said print receiving material, wherein said intaglio printing method further comprises the steps of:

• (1) immersing said intaglio printing master having said groove portions in said printing shape in said paste or said fused metal to fill said groove portions with said paste or said fused metal,
• (2) bringing a shielding plate into close and sliding contact with the surface of said printing master to remove said paste or said fused metal therefrom and to close the openings of said groove portions in which said paste or said fused metal is filled, with said shielding plate,
• (3) taking out said printing master to which said shielding plate is closely attached from said paste or said fused metal,
• (4) separating said shielding plate from the surface of said printing master,
• (5) bringing said printing master free of said shielding plate into close contact with said print receiving material, and
• (6) separating said printing master from said print receiving material to transfer said paste or said fused metal in said printing shape to said print receiving material.

A method of forming one of bumps and a wiring pattern on a substrate, using an intaglio printing master having one of bump female die portions and groove portions corresponding to said wiring pattern, each in a printing shape, depressed below the surface of said printing master, by an intaglio printing method comprising the steps of (a) bringing said intaglio printing master, with one of a paste and a fused metal being filled in said one of the bump female die portions and said groove portions, into close contact with a print receiving material, and (b) separating said intaglio printing master from said print receiving material to transfer said one of the paste and said fused metal to said print receiving material, wherein said intaglio printing method further comprises the steps of:

• (1) immersing said intaglio printing master having said one of the bump female die portions and said groove portions, each in said printing shapes, in said one of the paste and said fused metal to fill said one of the bump female die portions and said groove portions with said one of the paste and said fused metal,
• (2) bringing a shielding plate into close and sliding contact with the surface of said printing master to remove said one of the paste and said fused metal therefrom and to close the openings of said one of the bump female die portions and the openings of said groove portions in which said one of the paste and said fused metal is filled, with said shielding plate,
• (3) taking out said printing master to which said shielding plate is closely attached from said one of the paste and said fused metal,
• (4) separating said shielding plate from the surface of said printing master,
• (5) bringing said printing master free of said shielding plate into close contact with said print receiving material, and
• (6) separating said printing master from said print receiving material to transfer said one of the paste and said fused metal in said printing shapes to said print receiving material.

A method of forming one of bumps and a wiring pattern on a printed circuit board in a superimposed manner, using an intaglio printing master having one of bump female die portions and groove portions corresponding to said wiring pattern, each in a printing shape, depressed below the surface of said printing master, by an intaglio printing method comprising the steps of (a) bringing said intaglio printing master, with a paste and a fused metal being filled in said one of the bump female die portions and said groove portions, into close contact with a print receiving material, and (b) separating said intaglio printing master from said print receiving material to transfer said one of the paste and said fused metal to said print receiving material, wherein said intaglio printing method further comprises the steps of:

• (1) immersing said intaglio printing master having said one of the bump female die portions and said groove portions, each in said printing shape, in said one of the paste and said fused metal to fill said one of the bump female die portions and said groove portions with said one of the paste and said fused metal,
• (2) bringing a shielding plate into close and sliding contact with the surface of said printing master to remove said one of the paste and said fused metal therefrom and to close the openings of said one of the bump female die portions and the openings of said groove portions in which said one of the paste and said fused metal is filled, with said shielding plate,
• (3) taking out said printing master to which said shielding plate is closely attached from said one of the paste and said fused metal,
• (4) separating said shielding plate from the surface of said printing master,
• (5) bringing said printing master free of said shielding plate into close contact with said print receiving material, and
• (6) separating said printing master from said print receiving material to transfer said one of the paste and said fused metal in said printing shapes to said print receiving material.

A method of forming a wiring pattern on one of a front side or a back side of a printed circuit board and a resist-coated substrate and forming one of a junction portion and a crossover portion of said wiring pattern, using an intaglio printing master having groove portions depressed below the surface of said printing master, in a printing shape corresponding to said wiring pattern, by an intaglio printing method comprising the steps of (a) bringing said intaglio printing master, with one of a paste and a fused metal being filled in said groove portions, into close contact with a print receiving material, and (b) separating said intaglio printing master from said print receiving material to transfer said one of the paste and said fused metal to said print receiving material, wherein said intaglio printing method further comprises the steps of:

• (1) immersing said intaglio printing master having said groove portions in said printing shape in said one of the paste and said fused metal to fill said groove portions with said one of the paste and said fused metal,
• (2) bringing a shielding plate into close and sliding contact with the surface of said printing master to remove said one of the paste and said fused metal therefrom and to close the openings of said groove portions in which said one of the paste and said fused metal is filled, with said shielding plate,
• (3) taking out said printing master to which said shielding plate is closely attached from said one of the paste and said fused metal,
• (4) separating said shielding plate from the surface of said printing master,
• (5) bringing said printing master free of said shielding plate into close contact with said print receiving material, and
• (6) separating said printing master from said print receiving material to transfer said one of the paste and said fused metal in said printing shape to said print receiving material.

An apparatus for forming one of bumps and a wiring pattern on a substrate, which is capable of (a) bringing an intaglio printing master having one of bump female die portions and groove portions corresponding to said wiring pattern, each in a printing shape, depressed below the surface of said printing master, in which said one of the bump female die portions and said groove portions have one of a paste and a fused metal filled therein, into close contact with a print receiving material, and (b) separating said intaglio printing master from said print receiving material to transfer said one of the paste and said fused metal in said printing shape to said print receiving material, comprising:

• (1) an airtight housing for holding therein said one of the paste and said fused metal, provided with a vacant space therein,
• (2) means for changing pressure in said vacant space of said airtight housing,
• (3) a shielding plate which can be brought into close and sliding contact with the surface of said printing master which is immersed in said one of the paste and said fused metal to remove said one of the paste and said fused metal therefrom and to close the openings of said one of the bump female die portions and said groove portions in which said one of the paste and said fused metal is filled, with said shielding plate,
• (4) means for immersing said intaglio printing master in said one of the paste and said fused metal placed in said airtight housing, to fill said one of the bump female die portions and said groove portions with said one of the paste and said fused metal,
• (5) means for bringing said shielding plate into close and sliding contact with the surface of said printing master to remove said one of the paste and said fused metal therefrom and to close the openings of said one of the bump female die portions and said groove portions in which said one of the paste and said fused metal is filled, with said shielding plate,
• (6) means for taking out said printing master to which said shielding plate is closely attached from said one of the paste and said fused metal,
• (7) means for separating said shielding plate from the surface of said printing master,
• (8) means for bringing said printing master free of said shielding plate into close contact with said print receiving material, and
• (9) means for separating said printing master from said print receiving material to transfer said one of the paste and said fused metal in said printing shapes to said print receiving material.