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US 10,912,193 B2Granted
Structure, wiring board, substrate for wiring board, copper clad laminate, and method for manufacturing the structure
AssigneeKabushiki Kaisha Toshiba
InventorsHajime Nakashima, Izuru Komatsu
Life of this patent
Estimating the term…
Abstract
According to an embodiment, a structure is provided. The structure comprises a silicone formed product, water, and a protective member. The silicone formed product contains hydroxyl groups in at least a portion of a surface. The water is in contact with at least the portion of the surface containing the hydroxyl groups. The protective member retains the water.
Claims10
A structure, comprising:
- a silicone formed product containing silanol groups in at least a portion of a surface;
- water in contact with at least the portion of the surface containing the silanol groups;
- and
- a protective member for retaining the water.
1 more element
A method for manufacturing a structure, the method comprising:
- bringing water into contact with at least some of silanol groups in a silicone formed product containing the silanol groups in at least a portion of a surface;
- and
- providing a protective member to retain the water.
A method for manufacturing a structure, the method comprising:
- bringing water into contact with at least a portion of a surface of a silicone formed product containing silanol groups in at least a portion of the surface;
- and
- providing a protective member to retain the water.
Dependencies are inferred from the claim text.