Structure, wiring board, substrate for wiring board, copper clad laminate, and method for manufacturing the structure
AssigneeKabushiki Kaisha Toshiba
InventorsHajime NAKASHIMA, lzuru KOMATSU
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Abstract
According to an embodiment, a structure is provided. The structure comprises a silicone formed product, water, and a protective member. The silicone formed product contains hydroxyl groups in at least a portion of a surface. The water is in contact with at least the portion of the surface containing the hydroxyl groups. The protective member retains the water.
Claims11
A structure comprising:
- a silicone formed product containing hydroxyl groups in at least a portion of a surface;
- water in contact with at least the portion of the surface containing the hydroxyl groups;
- and
- a protective member for retaining the water.
A method for manufacturing a structure comprising bringing water into contact with at least some of hydroxyl groups in a silicone formed product containing hydroxyl groups in at least a portion of a surface.
A method for manufacturing a structure comprising bringing water into contact with at least a portion of a surface of a silicone formed product containing hydroxyl groups in at least a portion of the surface.
Dependencies are inferred from the claim text.