Fluid discharge device, fluid discharge method, and fluid application device

A fluid application device for forming a coated portion on a workpiece of an electronic component, the fluid application device comprising:

• a discharge head including a tank capable of accommodating a molten solder, and a nozzle formed at one end of the discharge head, the discharge head being configured to be positioned above the workpiece, the discharge head being configured in such a manner that the discharge head moves closer to the workpiece until the nozzle contacts the workpiece during preparation for formation of the coated portion;
• the discharge head moves horizontally with respect to the workpiece while ejecting the molten solder in the tank from the nozzle in a state where the nozzle is in contact with the workpiece during formation of the coated portion;
• and the discharge head moves away from the workpiece after the formation of the coated portion is completed and the ejection of the molten solder from the nozzle is stopped;
• a heater for keeping the molten solder in the tank at a desired temperature;
• first pressure supply means for supplying a first pressure into the tank and ejecting the molten solder in the tank onto the workpiece from an opening of the nozzle;
• second pressure supply means for supplying a second pressure into the tank and holding the molten solder in the tank without ejecting the molten solder from the opening of the nozzle;
• a pressure sensor for monitoring the pressure in the tank;
• a controller configured to control a pressure to be supplied into the tank based on a signal from the pressure sensor;
• and
• a solder supply configured to supply an additional solder into the tank so that the amount of the molten solder in the tank is kept constant when the molten solder in the tank is consumed during operation,
• wherein the solder supply is apart from the tank, and
• wherein both the first pressure supply means and the second pressure supply means are connected to the tank via a single common pipeline, and
• wherein a single valve controls fluid communiction through the single common pipeline that is shared by both the first and second pressure supply means, and the single valve is configured to switch between:
• (1) a state allowing fluid communication through the single common pipeline between only the first pressure supply means and the tank to provide the tank with the first pressure through the single common pipeline, and (2) a state allowing fluid communication through the single common pipeline between only the second pressure supply means and the tank to provide the tank with the second pressure through the single common pipeline.