H05K 2203/0108
Male die used for patterning, punching or transferring
H05K2203/0108 (Male die used for patterning, punching or transferring) appears on 326 US grants and 380 published applications in this corpus.
Search patents in H05K- Granted patents
- 326
- Published applications
- 380
- Assignees
- 198
- Inventors
- 831
- Latest grant
- 10 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 5 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 5 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 6 | 0 |
| 1993 | 8 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 2 |
| 2002 | 4 | 7 |
| 2003 | 9 | 14 |
| 2004 | 5 | 24 |
| 2005 | 9 | 28 |
| 2006 | 10 | 21 |
| 2007 | 10 | 28 |
| 2008 | 12 | 54 |
| 2009 | 15 | 32 |
| 2010 | 19 | 23 |
| 2011 | 21 | 13 |
| 2012 | 20 | 17 |
| 2013 | 6 | 11 |
| 2014 | 15 | 25 |
| 2015 | 23 | 22 |
| 2016 | 19 | 11 |
| 2017 | 8 | 12 |
| 2018 | 6 | 5 |
| 2019 | 11 | 3 |
| 2020 | 13 | 7 |
| 2021 | 2 | 4 |
| 2022 | 3 | 2 |
| 2023 | 1 | 1 |
| 2024 | 6 | 6 |
| 2025 | 1 | 4 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Patterned article including metallic bodies10 Mar 2026US 12,573,766 B23M Innovative Properties Company
- Thermoforming device and method for flexible circuit board10 Mar 2026US 12,575,033 B2Zte Corporation
- Patterned conductive article15 Jul 2025US 12,363,825 B23M Innovative Properties Company
- Systems and methods for shaping flexible circuits to improve routing and attachment26 Nov 2024US 12,156,342 B2Aptiv Technologies AG
- Patterned article including electrically conductive elements29 Oct 2024US 12,133,327 B23M Innovative Properties Company
- Wiring board2 Jul 2026US 2026/0190220 A1Panasonic Intellectual Property Management Co., Ltd.
- Patterned Article Including Metallic Bodies18 Jun 2026US 2026/0171679 A13M Innovative Properties Company
- Hybrid mold, method for manufacturing hybrid mold, wiring structure, and method for manufacturing wiring structure30 Apr 2026US 2026/0122788 A1Panasonic Intellectual Property Management Co., Ltd.
- Manufacturing method of circuit board12 Mar 2026US 2026/0075720 A1Unimicron Technology Corp.
- Component Carrier With Stamped Design Layer Structure and Embedded Component13 Nov 2025US 2025/0349727 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Most cited
By later US patents
- Method of manufacturing a thin-film pattern on a substrate253US 5,259,926 AHitachi, Ltd. · 1993
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992
- Trenching techniques for forming channels, vias and components in substrates116US 5,219,787 AMicroelectronics and Computer Technology Corporation · 1993
- Trenching techniques for forming vias and channels in multilayer electrical interconnects113US 5,091,339 AMicroelectronics and Computer Technology Corporation · 1992
- Circuit-like metallic foil sheet and the like and process for producing them112US 5,645,932 AKabushiki Kaisha Miyake · 1997