Thermoforming device and method for flexible circuit board
AssigneeZte Corporation
InventorsDa Chen, Fengying Wang, Yiming Li, Fugang Nie, Zhe Liu, Feng Wang, Yichuo Shi
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AssigneeZte Corporation
InventorsDa Chen, Fengying Wang, Yiming Li, Fugang Nie, Zhe Liu, Feng Wang, Yichuo Shi
Estimating the term…
Disclosed are a thermoforming device and method for a flexible printed circuit board. The thermoforming device may include: a first forming mechanism provided with a first forming portion, the first forming portion being configured to carry the flexible printed circuit board to be processed; a second forming mechanism provided with a second forming portion which matches with the first forming portion, at least one of the first forming portion or the second forming portion is provided with a corresponding heating module configured for heat treatment of the flexible printed circuit board; a first driving mechanism configured to drive the first forming mechanism and the second forming mechanism to be displaced relative to each other in a first direction; a second driving mechanism configured to drive the second forming mechanism and the first forming mechanism to be displaced relative to each other in a second direction perpendicular to the first direction; and a controller.
A thermoforming device for a flexible printed circuit board, comprising:
A thermoforming method for a flexible printed circuit board, applied to a thermoforming device for the flexible printed circuit board, wherein the thermoforming device comprises:
Dependencies are inferred from the claim text.