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US 2025/0349727 A1Published application
Component Carrier With Stamped Design Layer Structure and Embedded Component
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsHeinrich TRISCHLER, Marie SCALBERT, Erich PREINER
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Abstract
A component carrier includes a stack-having at least one electrically conductive layer structure and at least one electrically insulating layer structure where the at least one electrically insulating layer structure has at least one design layer structure with a stamped surface profile. A component embedded in the stack-is at least partially covered by the at least one design layer structure.
Claims20
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the at least one electrically insulating layer structure comprises at least one design layer structure having a stamped surface profile;
- and
- a component embedded in the stack and at least partially covered by the at least one design layer structure.
A method of manufacturing a component carrier, the method comprising:
- forming a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- stamping a surface profile in at least one design layer structure of the at least one electrically insulating layer structure;
- and
- embedding a component in the stack so that the component is at least partially covered by the at least one design layer structure.
1 more element
Dependencies are inferred from the claim text.