H05K 2201/2072
Anchoring, i.e. one structure gripping into another
H05K2201/2072 (Anchoring, i.e. one structure gripping into another) appears on 207 US grants and 232 published applications in this corpus.
Search patents in H05K- Granted patents
- 207
- Published applications
- 232
- Assignees
- 166
- Inventors
- 606
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 4 |
| 2002 | 3 | 0 |
| 2003 | 2 | 1 |
| 2004 | 1 | 2 |
| 2005 | 1 | 5 |
| 2006 | 2 | 5 |
| 2007 | 3 | 7 |
| 2008 | 3 | 7 |
| 2009 | 5 | 7 |
| 2010 | 5 | 7 |
| 2011 | 1 | 7 |
| 2012 | 11 | 7 |
| 2013 | 5 | 8 |
| 2014 | 8 | 19 |
| 2015 | 10 | 31 |
| 2016 | 22 | 16 |
| 2017 | 18 | 10 |
| 2018 | 11 | 6 |
| 2019 | 7 | 6 |
| 2020 | 12 | 16 |
| 2021 | 6 | 16 |
| 2022 | 14 | 8 |
| 2023 | 5 | 10 |
| 2024 | 4 | 14 |
| 2025 | 8 | 4 |
| 2026 | 2 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board and manufacturing method18 Aug 2026US 12,713,535 B2NHK Spring Co., Ltd.
- Printed wiring board18 Aug 2026US 12,713,538 B2Ibiden Co., Ltd.
- Wiring board9 Dec 2025US 12,495,486 B2KYOCERA Corporation
- Component carrier interconnection and manufacturing method9 Dec 2025US 12,495,498 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heat dissipation assembly and electric device thereof18 Nov 2025US 12,477,693 B2Giga-Byte Technology Co., Ltd.
- Systems for power module packaging16 Jul 2026US 2026/0206141 A1Dana Tm4 Italia S.R.L.
- Reinforcing plate and electrical component11 Jun 2026US 2026/0164540 A1Mektec Corporation
- Component carrier and method for manufacturing a component carrier14 May 2026US 2026/0136463 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Component Carrier and Method of Manufacturing the Same9 Apr 2026US 2026/0101434 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Compression defined broaching mounts for a compression-attached memory module (camm) connector platform26 Feb 2026US 2026/0059665 A1Advanced Micro Devices, Inc.
Most cited
By later US patents
- Card-type electronic device with plastic frame sandwiched between printed circuit boarding metal panel150US 5,784,259 ASeiko Epson Corporation · 1998
- Card-type electronic device with plastic frame sandwiched between printed circuit board and metal panel137US 5,742,479 ASeiko Epson Corporation · 1998
- Method of using a flexible circuit44US 7,658,470 B1Hewlett-Packard Development Company, L. P. · 2010
- Hybrid printed circuit board43US 5,434,749 AYazaki Corporation · 1995
- Process for making insert molded circuit42US 4,965,933 ACherry GmbH · 1990