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US 7,658,470 B1Granted
Method of using a flexible circuit
AssigneeHewlett-Packard Development Company, L.P.
InventorsBrian Jones, Robert Weber, Cary G Addington, Si-Lam Choy
Life of this patent
Estimating the term…
Abstract
A method of using a flexible circuit, including attaching a first portion of the flexible circuit, via an attaching surface of the flexible circuit, to a first surface of a chip carrier. Statically bending a bending portion of the flexible circuit around an edge formed at the intersection of the first surface of the chip carrier, and a second surface of the chip carrier. Adhesively attaching a second portion of the flexible circuit, via the attaching surface, to the second surface of the chip carrier, where the second portion of the flexible circuit has at least one first anchor structure formed in the attaching surface, where the at least one first anchor structure is adapted to accept an adhesive.
Claims62
A method of using a flexible circuit, comprising:
- attaching a first portion of the flexible circuit, via an attaching surface of the flexible circuit, to a first surface of a chip carrier, said chip carrier having said first surface including a first surface normal and a second surface including a second surface normal, said first and said second surface normals intersecting at an angle greater than 10 degrees, wherein said first and second surfaces form a edge, said first surface of said chip carrier having a fluid ejector chip mounted thereto, said fluid ejector chip having at least one fluid ejector disposed thereon;
- statically bending a bending portion of the flexible circuit around said edge;
- aligning said bending portion proximate to said first edge;
- adhesively attaching a second portion of the flexible circuit, via said attaching surface to said second surface of said chip carrier, said second portion of the flexible circuit having at least one first anchor structure formed in said attaching surface, wherein said at least one first anchor structure is adapted to accept an adhesive, and wherein no conductive trace of said flexible circuit protrudes into said at least one first anchor structure;
- and
- forming at least one adhesive anchor by flowing said adhesive into said at least one first anchor structure from said attaching surface while adhesively attaching said flexible circuit to said second surface.
3 more elements
A fluid ejection device, comprising:
- at least one fluid ejector disposed over a fluid ejector chip;
- a chip carrier mounted to said fluid ejector chip, said chip carrier having a first surface including a first surface normal and a second surface including a second surface normal, said first and said second surface normals intersect at angle greater than 10 degrees, wherein said first and second surfaces form an edge;
- a flexible circuit having a first portion, a bending portion, and a second portion, said second portion having at least one first anchor structure formed in an attaching surface of said flexible circuit, said first portion attached to said first surface of said chip carrier, said bending portion statically bent around said edge, and said attaching surface attached by an adhesive to said second surface, wherein said bending portion is aligned at least proximate to said edge, and wherein no conductive trace of said flexible circuit protrudes into said at least one first anchor structure;
- and
- at least one adhesive anchor formed by flow of said adhesive into said at least one first anchor structure from said attaching surface during attachment of said flexible circuit to said second surface.
2 more elements
A fluid ejection device, comprising:
- at least one fluid ejector disposed over a fluid ejector chip;
- a chip carrier mounted to said fluid ejector chip, said chip carrier having a first surface including a first surface normal and a second surface including a second surface normal, said first and said second surface normals intersect at angle greater than 10 degrees, wherein said first and second surfaces form an edge;
- and
- a flexible circuit having a first portion, a bending portion, and a second portion, said second portion having at least one first anchor structure formed in an attaching surface of said flexible circuit, said first portion attached to said first surface of said chip carrier, said bending portion statically bent around said edge, and said second portion adhesively attached to said second surface, wherein said bending portion is aligned at least proximate to said edge, and wherein said at least one first anchor structure further comprises a first anchor portion disposed substantially over a second anchor portion, said first anchor portion in contact with, and having different sidewalls from, said second anchor portion.
1 more element
A fluid ejection device, comprising:
- at least one fluid ejector disposed over a fluid ejector chip;
- a chip carrier mounted to said fluid ejector chip, said chip carrier having a first surface including a first surface normal and a second surface including a second surface normal, said first and said second surface normals intersect at angle greater than 10 degrees, wherein said first and second surfaces form an edge;
- a flexible circuit having a first portion, a bending portion, and a second portion, said second portion having at least one first anchor structure formed in an attaching surface of said flexible circuit, said first portion attached to said first surface of said chip carrier, said bending portion statically bent around said edge, and said attaching surface attached by an adhesive to said second surface, wherein said bending portion is aligned at least proximate to said edge;
- and
- at least one adhesive anchor formed by flow of said adhesive into said at least one first anchor structure from said attaching surface during attachment of said flexible circuit to said second surface, wherein said at least first anchor structure is recessed partway into said flexible circuit from said attaching surface and does not extend through said flexible circuit to its opposing surface.
2 more elements
A fluid ejection device, comprising:
- at least one fluid ejector disposed over a fluid ejector chip;
- a chip carrier mounted to said fluid ejector chip, said chip carrier having a first surface including a first surface normal and a second surface including a second surface normal, said first and said second surface normals intersect at angle greater than 10 degrees, wherein said first and second surfaces form an edge;
- a flexible circuit having a first portion, a bending portion, and a second portion, said second portion having at least one first anchor structure formed in an attaching surface of said flexible circuit, said first portion attached to said first surface of said chip carrier, said bending portion statically bent around said edge, and said attaching surface attached by an adhesive to said second surface, wherein said bending portion is aligned at least proximate to said edge;
- and
- at least one adhesive anchor formed by flow of said adhesive into said at least one first anchor structure from said attaching surface during attachment of said flexible circuit to said second surface, wherein said flexible circuit further comprises one or more first anchor structures formed in said first portion of said flexible circuit.
2 more elements
Dependencies are inferred from the claim text.