Component Carrier and Method of Manufacturing the Same

Abstract

A component carrier and a method of manufacturing the component carrier are presented. The component carrier includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. The at least one electrically insulating layer structure has a first main surface and an opposing second main surface, and at least one cavity formed in the first main surface of the at least one electrically insulating layer structure. The cavity is delimited by a bottom wall and a sidewall. A surface of the bottom wall and a surface of the sidewall of the at least one cavity have a different roughness Ra than the first main surface and/or than the second main surface of the at least one electrically insulating layer structure.

Dependencies are inferred from the claim text.