H05K 2201/10416
Metallic blocks or heatsinks completely inserted in a pcb
Official title: Metallic blocks or heatsinks completely inserted in a PCB
H05K2201/10416 (Metallic blocks or heatsinks completely inserted in a pcb) appears on 438 US grants and 465 published applications in this corpus.
Search patents in H05K- Granted patents
- 438
- Published applications
- 465
- Assignees
- 307
- Inventors
- 1,201
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 6 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 10 | 0 |
| 1998 | 13 | 0 |
| 1999 | 7 | 0 |
| 2000 | 11 | 0 |
| 2001 | 12 | 3 |
| 2002 | 9 | 19 |
| 2003 | 8 | 10 |
| 2004 | 13 | 16 |
| 2005 | 13 | 11 |
| 2006 | 7 | 18 |
| 2007 | 10 | 15 |
| 2008 | 9 | 14 |
| 2009 | 6 | 14 |
| 2010 | 6 | 17 |
| 2011 | 8 | 10 |
| 2012 | 11 | 10 |
| 2013 | 12 | 13 |
| 2014 | 11 | 19 |
| 2015 | 11 | 18 |
| 2016 | 11 | 33 |
| 2017 | 23 | 20 |
| 2018 | 26 | 26 |
| 2019 | 26 | 15 |
| 2020 | 14 | 14 |
| 2021 | 20 | 41 |
| 2022 | 20 | 28 |
| 2023 | 20 | 14 |
| 2024 | 21 | 32 |
| 2025 | 19 | 19 |
| 2026 | 10 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board and method of manufacturing the same22 Sep 2026US 12,745,342 B2Rolls-Royce Deutschland Ltd & Co KG
- Carrier substrate, a method, and an electronic assembly22 Sep 2026US 12,745,343 B2Telefonaktiebolaget LM Ericsson (publ)
- Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate25 Aug 2026US 12,720,666 B2LG Innotek Co., Ltd.
- Printed circuit board and method for making the same30 Jun 2026US 12,672,232 B2Tong Hsing Electronic Industries, Ltd.
- Solid state power switch assembly of an aircraft solid state power controller and method of providing a solid state power switch assembly for an aircraft solid state power controller2 Jun 2026US 12,646,907 B2Hs Elektronik Systeme GmbH
- Method for manufacturing integrated power electronics6 Aug 2026US 2026/0231339 A1Toyota Motor Engineering & Manufacturing North America, Inc.
- Embedded liquid cooling assembly and electronic device16 Jul 2026US 2026/0206177 A1AAC Microtech (Changzhou) Co., Ltd.
- Double-sided chip-embedded circuit board and manufacturing method therefor11 Jun 2026US 2026/0164532 A1ZF Friedrichshafen AG
- Multi-layer circuit board having embedded board-type chip and manufacturing method therefor11 Jun 2026US 2026/0164534 A1ZF Friedrichshafen AG
- Method for manufacturing chip-embedded circuit board and chip-embedded circuit board11 Jun 2026US 2026/0165151 A1ZF Friedrichshafen AG
Most cited
By later US patents
- Attachment assembly for integrated circuits278US 5,856,911 ANational Semiconductor Corporation · 1999
- Coaxial vias in an electronic substrate144US 5,541,567 AInternational Business Machines Corporation · 1996
- Circuit module with enhanced heat transfer and distribution118US 4,628,407 ACray Research, Inc. · 1986
- Shared socket multi-chip module and/or piggyback pin grid array package118US 5,734,555 AIntel Corporation · 1998
- Chip-carrier substrates111US 4,509,096 ASmiths Industries Public Limited Company · 1985