Embedded liquid cooling assembly and electronic device

An electronic device, comprising an embedded liquid cooling assembly comprising a circuit board, a power chip and a liquid cooling plate, wherein the circuit board is a multilayer circuit board, and the circuit board comprises a first circuit board layer for attaching the power chip, a second circuit board layer for serving as a bottom plate, and a third circuit board layer sandwiched between the first circuit board layer and the second circuit board layer;

• the liquid cooling plate is sandwiched between the first circuit board layer and the second circuit board layer and arranged at the same layer as the third circuit board layer, and an orthographic projection of the liquid cooling plate towards the first circuit board layer covers the power chip;
• the liquid cooling plate comprises a liquid cooling plate body, and a cooling liquid output tube and a cooling liquid input tube extending from the liquid cooling plate body towards an outside of the circuit board, the liquid cooling plate body is sandwiched between the first circuit board layer and the second circuit board layer, an accommodating cavity is formed in the liquid cooling plate body, cooling liquid is introduced into the accommodating cavity, and the cooling liquid output tube and the cooling liquid input tube are respectively communicated with the accommodating cavity.