Double-sided chip-embedded circuit board and manufacturing method therefor

A manufacturing method for manufacturing a double-sided chip-embedded circuit board, the manufacturing method comprising:

• providing a prefabricated circuit board, with each of an upper surface and a lower surface of the prefabricated circuit board being a conductive layer;
• embedding a chip packaging unit in the prefabricated circuit board;
• sequentially adhering an upper dielectric layer and an upper conductive film layer to the upper surface of the prefabricated circuit board, and forming an electrode lead-out wire in each of the upper dielectric layer and the upper conductive film layer to lead out an electrode of the chip packaging unit to a surface of the upper conductive film layer;
• and
• sequentially adhering a lower dielectric layer and a lower conductive film layer to the lower surface of the prefabricated circuit board, and forming a slot in each of the lower dielectric layer and the lower conductive film layer to expose a backside of the chip packaging unit, wherein heat dissipation fins are provided on the backside of the chip packaging unit, or the heat dissipation fins are further formed on the backside of the chip packaging unit.