Multi-layer circuit board having embedded board-type chip and manufacturing method therefor

Abstract

A multi-layer board-type chip-embedded circuit board includes: a prefabricated circuit board; a chip packaging unit embedded therein; and groups of first conductive modules stacked below the board and provided with a slot from which the chip packaging unit is exposed, such that a heat dissipation cavity is formed between a back surface of the chip packaging unit and the slot, and the heat dissipation cavity is filled with an auxiliary heat dissipation material that is in contact with the chip packaging unit and the groups of first conductive modules. In this manner, the signal transmission capability are greatly enhanced, and stable operation of the circuit board and stable transmission of electrical signals are ensured; and heat generated during operating the chip packaging unit and the first conductive modules is quickly removed by the auxiliary heat dissipation material filled in the heat dissipation cavity, thereby achieving effective heat dissipation.

Dependencies are inferred from the claim text.