Method for manufacturing chip-embedded circuit board and chip-embedded circuit board

Abstract

A method for manufacturing a chip-embedded circuit board includes: providing a mounting recess in a pre-manufactured circuit board; embedding a chip packaging unit in the mounting recess such that upper and lower surfaces of the chip packaging unit are flush with upper and lower surfaces of the board; forming an electrode lead-out structure on the upper surface of the pre-manufactured circuit board by: stacking a dielectric layer and a conductive layer on the upper surface, providing through holes in the dielectric and the conductive layers to expose electrodes of the chip packaging unit, and filling the holes with conductive material to form electrode leads of the chip packaging unit; and providing slots in a back surface of the chip packaging unit to form heat dissipation fins flush with the lower surface of the board. A chip-embedded circuit board so manufactured has a robust structure with operational and heat dissipation performance.

Dependencies are inferred from the claim text.