H05K 2201/0776
Resistance and impedance
H05K2201/0776 (Resistance and impedance) appears on 214 US grants and 237 published applications in this corpus.
Search patents in H05K- Granted patents
- 214
- Published applications
- 237
- Assignees
- 173
- Inventors
- 574
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 5 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 4 | 0 |
| 1999 | 2 | 0 |
| 2000 | 7 | 0 |
| 2001 | 3 | 0 |
| 2002 | 6 | 9 |
| 2003 | 5 | 4 |
| 2004 | 6 | 3 |
| 2005 | 2 | 10 |
| 2006 | 2 | 13 |
| 2007 | 8 | 13 |
| 2008 | 9 | 15 |
| 2009 | 8 | 9 |
| 2010 | 11 | 11 |
| 2011 | 7 | 5 |
| 2012 | 6 | 3 |
| 2013 | 5 | 5 |
| 2014 | 2 | 11 |
| 2015 | 8 | 6 |
| 2016 | 4 | 9 |
| 2017 | 7 | 8 |
| 2018 | 7 | 9 |
| 2019 | 9 | 11 |
| 2020 | 9 | 21 |
| 2021 | 13 | 12 |
| 2022 | 14 | 11 |
| 2023 | 11 | 8 |
| 2024 | 6 | 10 |
| 2025 | 7 | 10 |
| 2026 | 6 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Printed circuit board to dielectric waveguide interface6 Oct 2026US 12,756,084 B1Northrop Grumman Systems Corporation
- Sensor interposer employing castellated through-vias30 Jun 2026US 12,672,235 B2DexCom, Inc.
- Impedance matched via connections in a printed circuit board9 Jun 2026US 12,652,757 B2The Phoenix Company of Chicago, Inc.
- System and method for reducing power losses for magnetics integrated in a printed circuit board24 Mar 2026US 12,586,709 B2Rockwell Automation Technologies, Inc.
- Circuit board arrangement comprising a circuit board provided with a graphene island and method of communicating between a first and a second circuit24 Mar 2026US 12,588,141 B2Telefonaktiebolaget Ericsson LM (publ)
- Overlapped interconnect with enhanced design1 Oct 2026US 2026/0304601 A1Micron Technology, Inc.
- Sensor interposer employing castellated through-vias17 Sep 2026US 2026/0282225 A1DexCom, Inc.
- Circuit board with hybrid wiring structure10 Sep 2026US 2026/0271186 A1Primax Electronics Ltd.
- Bandwidth enhancement for data storage devices having flip chip memory dies27 Aug 2026US 2026/0255469 A1SanDisk Technologies LLC
- Power semiconductor module30 Jul 2026US 2026/0223747 A1Dynex Semiconductor Limited
Most cited
By later US patents
- Method for reducing via inductance in an electronic assembly and article190US 6,021,564 AW. L. Gore & Associates, Inc. · 2000
- Electronic structures having a joining geometry providing reduced capacitive loading90US 5,471,090 AInternational Business Machines Corporation · 1995
- Surface mountable microwave IC package88US 4,626,805 ATektronix, Inc. · 1986
- Test point monitor using embedded passive resistance86US 6,753,679 B1Nortel Networks Limited · 2004
- High frequency microwave packaging having a dielectric gap67US 6,204,448 B1Kyocera America, Inc. · 2001