Surface mountable microwave IC package
AssigneeTektronix, Inc.
InventorKeith E. Jones
Life of this patent
Estimating the term…
Abstract
A surface mountable microwave IC package uses printed transmission lines on a printed circuit board in lieu of plumbing between milled packages. A backside co-planar waveguide is connected to a topside microstrip line by a through-hole in a carrier substrate. To compensate for inductance added by the hole and transmission line ends, a gap is adjusted to provide compensation capacitance. Hermetic sealing of the package is assured by brazing a lead frame over the through-hole and using a solder sealed lid. The lid provides both a hermetic seal and shielding.
Claims9
A surface mountable microwave package comprising:
- a printed circuit board having a first microwave transmission line thereon with ground pads adjacent the end of said microwave transmission line;
- a carrier substrate;
- a co-planar transmission line on the bottom of said substrate situated so as to make electrical contact with said first microwave transmission line on said printed circuit board;
- a second microwave transmission line on the top of said carrier substrate connected to said co-planar transmission line via a metallized through-hole, an integrated circuit being connected to said second microwave transmission line;
- said package, during operation, having said carrier substrate placed on and connected to said printed circuit board.
A surface mountable microwave IC package for mounting on a printed circuit board having a first microwave transmission line, said IC package comprising:
- a carrier substrate;
- a co-planar waveguide transmission line on the bottom of said carrier substrate configured for connection to said first microwave transmission line;
- and
- a second microwave transmission line on the top of said carrier substrate, electrically connected to said co-planar waveguide transmission line via a metallized through-hole, to which an integrated circuit is electrically connected;
- and
- said package, during operation, having said carrier substrate placed on and connected to said printed circuit board.
Dependencies are inferred from the claim text.