US 2026/0271186 A1 · CIRCUIT BOARD WITH HYBRID WIRING STRUCTURE

Abstract

A circuit board with a hybrid wiring structure is provided. The circuit board includes a substrate, a low-impedance wiring set and a printed wiring set. The low-impedance wiring set includes at least one first low-impedance conductive trace and a second low-impedance conductive trace. The first low-impedance conductive trace is formed on a first surface of the substrate. The second low-impedance conductive trace is formed in the substrate. The printed wiring set includes a printed conductive trace. The printed conductive trace is formed on the first surface of the substrate. The printed conductive trace is electrically connected with two first low-impedance conductive traces. The resistance value of the printed wiring set is higher than the resistance value of the low-impedance wiring set.

Claims11

Dependent claims

A circuit board with a hybrid wiring structure, the circuit board comprising:

a substrate having a first surface and a second surface, which are opposed to each other;
at least one low-impedance wiring set having a first resistance value, and comprising at least one first low-impedance conductive trace, wherein the at least one first low-impedance conductive trace is formed on the first surface of the substrate;
and
at least one printed wiring set having a second resistance value, and comprising at least one printed conductive trace, wherein the at least one printed conductive trace is formed on the first surface of the substrate, and the at least one printed conductive trace is electrically connected with the at least one first low-impedance conductive trace, wherein the second resistance value is higher than the first resistance value.

1 more element

Dependencies are inferred from the claim text.

Circuit board with hybrid wiring structure

Life of this patent

Circuit board with hybrid wiring structure

Life of this patent

Abstract

Claims11