H05K 1/0263
High current adaptations
Official title: {High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K1/0293 takes precedence)}
H05K1/0263 (High current adaptations) appears on 1,120 US grants and 1,196 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,120
- Published applications
- 1,196
- Assignees
- 592
- Inventors
- 2,694
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 8 | 0 |
| 1983 | 8 | 0 |
| 1984 | 5 | 0 |
| 1985 | 8 | 0 |
| 1986 | 7 | 0 |
| 1987 | 7 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 10 | 0 |
| 1991 | 4 | 0 |
| 1992 | 7 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 12 | 0 |
| 1996 | 10 | 0 |
| 1997 | 3 | 0 |
| 1998 | 14 | 0 |
| 1999 | 14 | 0 |
| 2000 | 8 | 0 |
| 2001 | 11 | 11 |
| 2002 | 34 | 36 |
| 2003 | 29 | 33 |
| 2004 | 33 | 40 |
| 2005 | 25 | 40 |
| 2006 | 31 | 55 |
| 2007 | 32 | 37 |
| 2008 | 29 | 38 |
| 2009 | 30 | 47 |
| 2010 | 32 | 46 |
| 2011 | 32 | 42 |
| 2012 | 45 | 40 |
| 2013 | 24 | 28 |
| 2014 | 32 | 53 |
| 2015 | 33 | 45 |
| 2016 | 36 | 43 |
| 2017 | 45 | 52 |
| 2018 | 51 | 62 |
| 2019 | 73 | 68 |
| 2020 | 73 | 62 |
| 2021 | 42 | 50 |
| 2022 | 45 | 49 |
| 2023 | 33 | 63 |
| 2024 | 49 | 51 |
| 2025 | 49 | 65 |
| 2026 | 21 | 40 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multilayer circuit board, drive control device, and motor unit for electric power steering25 Aug 2026US 12,719,339 B2Mitsubishi Electric Corporation
- Structurally enhanced filtering of circuit board planes18 Aug 2026US 12,713,518 B2Microsoft Technology Licensing, LLC
- High-current element for high-current printed circuit boards21 Jul 2026US 12,690,124 B2ZF Friedrichshafen AG
- Methods and systems of compressor control with surge avoidance and response7 Jul 2026US 12,674,487 B2
- Non-symmetric single circuit board assembly with logic and power components16 Jun 2026US 12,658,757 B2Steering Solutions IP Holding Corporation
- Systems with vertical power distribution network vias and multiple printed circuit board subassemblies8 Oct 2026US 2026/0313786 A1
- Power modules13 Aug 2026US 2026/0240002 A1STMicroelectronics International N. V.
- High current printed electronics cable harness connection30 Jul 2026US 2026/0223280 A1Jabil Inc.
- Power semiconductor module23 Jul 2026US 2026/0215307 A1Dynex Semiconductor Limited
- Electrical connection unit16 Jul 2026US 2026/0204811 A1Yazaki Corporation
Most cited
By later US patents
- Leaded semiconductor device having accessible power supply pad terminals251US 5,508,556 AMotorola, Inc. · 1996
- Electronic assembly with trench structures and methods of manufacture145US 6,388,207 B1Intel Corporation · 2002
- Controller system for pool and/or spa137US 6,747,367 B2Balboa Instruments, Inc. · 2004
- Inter-circuit encapsulated packaging132US 6,304,450 B1INCEP Technologies, Inc. · 2001
- Laminated electronic package including a power/ground assembly117US 5,574,630 AInternational Business Machines Corporation · 1996