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US 2026/0240002 A1Published application
Power modules
AssigneeSTMicroelectronics International N.V.
InventorsInpil YOO, Indrajit PAUL
Life of this patent
Estimating the term…
Abstract
The present disclosure is directed to a power module that powers and controls various electronics, such an electric motor of an electric vehicle. The device includes a plurality of dies on a substrate, and a molding covering the dies and the substrate. The substrate is positioned on a heat sink. Connection pins are electrically coupled to the dies, and extend from the dies, through the molding, and into a printed circuit board. The printed circuit board is spaced from an upper surface of the molding.
Claims20
A device, comprising:
- a first heat sink;
- a first substrate on the first heat sink;
- a first plurality of dies on the first substrate;
- a first molding on the first plurality of dies and the first substrate;
- a first plurality of connection pins electrically coupled to the first plurality of dies;
- and
- a printed circuit board electrically coupled to the first plurality of connection pins,
- the first plurality of connection pins extending from the first plurality of dies, through a surface of the first molding, and to the printed circuit board,
- the printed circuit board being spaced from the surface of the first molding.
6 more elements
A method, comprising:
- positioning a plurality of dies on a substrate;
- electrically coupling a plurality of connection pins to the plurality of dies;
- forming a molding on the plurality of dies and the substrate;
- positioning the substrate on a heat sink;
- and
- electrically coupling a printed circuit board to the plurality of connection pins by inserting the plurality of connection pins into the printed circuit board,
- the plurality of connection pins extending from the plurality of dies, through a surface of the molding, and to the printed circuit board,
- the printed circuit board being spaced from the surface of the molding.
5 more elements
A system, comprising:
- a printed circuit board;
- a plurality of heat sinks;
- and
- a plurality of devices positioned between the printed circuit board and the plurality of heat sinks, each of the plurality of devices including:
- a substrate;
- a plurality of dies on the substrate;
- a molding on the plurality of dies and the substrate;
- and
- a plurality of connection pins electrically coupled between the plurality of dies and the printed circuit board,
- the plurality of connection pins extending from the plurality of dies, through a surface of the molding, and to the printed circuit board,
- the printed circuit board being spaced from the surface of the molding.
8 more elements
Dependencies are inferred from the claim text.