H05K 1/0265
Characterized by the lay-out of or details of the printed conductors
Official title: {characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections}
H05K1/0265 (Characterized by the lay-out of or details of the printed conductors) appears on 444 US grants and 494 published applications in this corpus.
Search patents in H05K- Granted patents
- 444
- Published applications
- 494
- Assignees
- 284
- Inventors
- 1,138
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 2 | 0 |
| 1998 | 10 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 1 | 0 |
| 2002 | 10 | 7 |
| 2003 | 6 | 7 |
| 2004 | 7 | 14 |
| 2005 | 7 | 13 |
| 2006 | 12 | 20 |
| 2007 | 10 | 15 |
| 2008 | 13 | 15 |
| 2009 | 6 | 20 |
| 2010 | 15 | 19 |
| 2011 | 13 | 16 |
| 2012 | 21 | 21 |
| 2013 | 11 | 17 |
| 2014 | 17 | 22 |
| 2015 | 18 | 17 |
| 2016 | 17 | 22 |
| 2017 | 19 | 17 |
| 2018 | 14 | 25 |
| 2019 | 31 | 27 |
| 2020 | 33 | 32 |
| 2021 | 18 | 29 |
| 2022 | 19 | 19 |
| 2023 | 14 | 29 |
| 2024 | 25 | 22 |
| 2025 | 25 | 31 |
| 2026 | 12 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multilayer circuit board, drive control device, and motor unit for electric power steering25 Aug 2026US 12,719,339 B2Mitsubishi Electric Corporation
- Structurally enhanced filtering of circuit board planes18 Aug 2026US 12,713,518 B2Microsoft Technology Licensing, LLC
- High-current element for high-current printed circuit boards21 Jul 2026US 12,690,124 B2ZF Friedrichshafen AG
- Methods and systems of compressor control with surge avoidance and response7 Jul 2026US 12,674,487 B2
- Non-symmetric single circuit board assembly with logic and power components16 Jun 2026US 12,658,757 B2Steering Solutions IP Holding Corporation
- High current printed electronics cable harness connection30 Jul 2026US 2026/0223280 A1Jabil Inc.
- Power semiconductor module23 Jul 2026US 2026/0215307 A1Dynex Semiconductor Limited
- Wiring circuit board18 Jun 2026US 2026/0173256 A1Nitto Denko Corporation
- Multilayer Circuit Board and Electronic Device Using Same18 Jun 2026US 2026/0173268 A1AAC Microtech (Changzhou) Co., Ltd.
- Wiring circuit board11 Jun 2026US 2026/0164544 A1Nitto Denko Corporation
Most cited
By later US patents
- Laminated electronic package including a power/ground assembly117US 5,574,630 AInternational Business Machines Corporation · 1996
- Multilayer printed circuit board and method for fabricating same109US 5,451,721 AInternational Business Machines Corporation · 1995
- Printed wiring board and method for producing the same106US 6,715,204 B1Ibiden Co., Ltd. · 2004
- Layered planar transmission lines88US 5,408,053 AHughes Aircraft Company · 1995
- Method of making multilayer printed circuit board83US 3,932,932 AInternational Telephone and Telegraph Corporation · 1976