US 2026/0215307 A1Published application

Power semiconductor module

AssigneesDynex Semiconductor Limited, Zhuzhou Crrc Times Semiconductor Co. Ltd

InventorsRobin Adam SIMPSON, Michael David NICHOLSON

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Abstract

A power semiconductor includes a substrate comprising an electrically insulating body and a patterned electrically conductive layer arranged on a surface of the electrically insulating body, wherein the patterned electrically conductive layer comprises first, second and third conductive tracks which are spaced apart from one another; a first power semiconductor device T1 and/or T2 comprising first and second power electrodes; a second power semiconductor device T3 and/or T4 comprising third and fourth power electrodes; and a circuit board comprising a plurality of electrically conductive layers stacked with a plurality of electrically insulating layers along a stacking direction Z; and the plurality of electrically conductive layers comprises first, second and third electrically conductive layers which are spaced apart from one another along the stacking direction.

Claims26

Dependent claims

A power semiconductor module comprising:

a substrate comprising an electrically insulating body and a patterned electrically conductive layer arranged on a surface of the electrically insulating body, wherein the patterned electrically conductive layer comprises first, second and third conductive tracks which are spaced apart from one another;
a first power semiconductor device comprising first and second power electrodes;
a second power semiconductor device comprising third and fourth power electrodes;
and
a circuit board, wherein:
the first and second power semiconductor devices are arranged between the circuit board and the substrate;
the circuit board comprises a plurality of electrically conductive layers stacked with a plurality of electrically insulating layers along a stacking direction;
at least one of the electrically insulating layers is arranged between adjacent ones of the electrically conductive layers;
and the plurality of electrically conductive layers comprises first, second and third electrically conductive layers which are spaced apart from one another along the stacking direction;
wherein:
the first power electrode is electrically connected to the first electrically conductive layer, and the first electrically conductive layer is further electrically connected to the first conductive track;
the second and third power electrodes are both electrically connected to the third electrically conductive layer, and the third electrically conductive layer is further electrically connected to the third conductive track;
the fourth power electrode is electrically connected to the second electrically conductive layer, and the second electrically conductive layer is further electrically connected to the second conductive track;
and
the second electrically conductive layer is arranged between the first and third electrically conductive layers.

12 more elements

A method of manufacturing a power semiconductor module, comprising:

attaching first and second power semiconductor devices to a circuit board, wherein the circuit board comprises a plurality of electrically conductive layers stacked with a plurality of electrically insulating layers along a stacking direction, wherein at least one of the electrically insulating layers is arranged between adjacent ones of the electrically conductive layers, and the plurality of electrically conductive layers comprises first, second and third electrically conductive layers which are spaced apart from one another along the stacking direction, and the second electrically conductive layer is arranged between the first and third electrically conductive layers, and wherein the first power semiconductor device comprises first and second power electrodes, and the second power semiconductor device comprises third and fourth power electrodes;
and
mounting the circuit board to a substrate such that the first and second power semiconductor devices are arranged between the circuit board and the substrate, wherein the substrate comprises an electrically insulating body and a patterned electrically conductive layer arranged on a surface of the electrically insulating body, and wherein the patterned electrically conductive layer comprises first, second and third conductive tracks which are spaced apart from one another;
wherein attaching the first and second power semiconductor devices to the circuit board comprises:
electrically connecting the first power electrode to the first electrically conductive layer;
electrically connecting each of the second and third power electrodes to the third electrically conductive layer;
and electrically connecting the fourth power electrode to the second electrically conductive layer;
and
wherein mounting the circuit board to the substrate comprises:
electrically connecting the first electrically conductive layer to the first conductive track;
electrically connecting the third electrically conductive layer to the third conductive track;
and electrically connecting the second electrically conductive layer to the second conductive track.

9 more elements

Dependencies are inferred from the claim text.