H03H 3/08
For the manufacture of resonators or networks using surface acoustic waves
Official title: for the manufacture of resonators or networks using surface acoustic waves
H03H3/08 (For the manufacture of resonators or networks using surface acoustic waves) appears on 1,146 US grants and 1,292 published applications in this corpus.
Search patents in H03H- Granted patents
- 1,146
- Published applications
- 1,292
- Assignees
- 242
- Inventors
- 1,700
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 6 | 0 |
| 1978 | 4 | 0 |
| 1979 | 2 | 0 |
| 1980 | 6 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 3 | 0 |
| 1984 | 7 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 10 | 0 |
| 1993 | 4 | 0 |
| 1994 | 6 | 0 |
| 1995 | 4 | 0 |
| 1996 | 7 | 0 |
| 1997 | 7 | 0 |
| 1998 | 15 | 0 |
| 1999 | 11 | 0 |
| 2000 | 7 | 0 |
| 2001 | 12 | 11 |
| 2002 | 26 | 30 |
| 2003 | 28 | 32 |
| 2004 | 27 | 47 |
| 2005 | 22 | 36 |
| 2006 | 27 | 37 |
| 2007 | 38 | 27 |
| 2008 | 27 | 22 |
| 2009 | 27 | 16 |
| 2010 | 15 | 27 |
| 2011 | 21 | 20 |
| 2012 | 16 | 32 |
| 2013 | 16 | 26 |
| 2014 | 28 | 30 |
| 2015 | 27 | 33 |
| 2016 | 32 | 28 |
| 2017 | 33 | 81 |
| 2018 | 33 | 50 |
| 2019 | 70 | 83 |
| 2020 | 71 | 88 |
| 2021 | 47 | 88 |
| 2022 | 55 | 86 |
| 2023 | 78 | 110 |
| 2024 | 78 | 95 |
| 2025 | 93 | 102 |
| 2026 | 59 | 55 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Packaged acoustic wave devices with multilayer piezoelectric substrate6 Oct 2026US 12,756,372 B2Skyworks Solutions, Inc.
- Surface acoustic wave device6 Oct 2026US 12,756,375 B2United Microelectronics Corp.
- Heterostructure and method of fabrication22 Sep 2026US 12,744,508 B2Soitec
- Multilayer piezoelectric substrate device with polycrystalline substrate22 Sep 2026US 12,744,509 B2Skyworks Solutions, Inc.
- Die package with sealed die enclosures15 Sep 2026US 12,738,918 B2QUALCOMM Incorporated
- Acoustic wave device with reduced acoustic coupling17 Sep 2026US 2026/0280513 A1Skyworks Solutions, Inc.
- Longitudinal mode surface acoustic wave resonator with energy confinement layer and a method of manufacture17 Sep 2026US 2026/0280516 A1RF360 Singapore Pte. Ltd.
- Surface acoustic wave resonator device and manufacturing method thereof17 Sep 2026US 2026/0280524 A1Shenzhen Newsonic Technologies Co., Ltd.
- Acoustic wave device, method for manufacturing acoustic wave device, and communication device10 Sep 2026US 2026/0269805 A1KYOCERA Corporation
- Elastic surface wave device having electrodes embedded in a piezoelectric layer, and design and production thereof27 Aug 2026US 2026/0254434 A1
Most cited
By later US patents
- Electronic part and a method of production thereof357US 5,920,142 AMatsushita Electric Industrial Co., Ltd. · 1999
- Lamb wave device292US 7,535,152 B2Murata Manufacturing Co., Ltd. · 2009
- Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics289US 7,105,980 B2Sawtek, Inc. · 2006
- Method for producing an electronic component using direct bonding273US 5,771,555 AMatsushita Electric Industrial Co., Ltd. · 1998
- Elastic wave device and manufacturing method for same267US 9,748,923 B2Murata Manufacturing Co., Ltd. · 2017