Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics

A surface acoustic wave (SAW) device comprising:

• a piezoelectric substrate having a thickness at least twice an acoustic wavelength of a SAW;
• an electrode pattern on a surface of the piezoelectric substrate for generating or detecting the SAW;
• a surrogate substrate characterized by a resistivity of at least 30 ohm-cm and a thermal conductivity for facilitating thermal diffusion;
• and
• a silicon oxide bonding film securing the piezoelectric substrate to the surrogate substrate, wherein the silicon oxide bonding film comprises a thickness of at least one micron.

A surface acoustic wave (SAW) device comprising:

• a piezoelectric substrate having a thickness at least twice an acoustic wavelength of a SAW;
• a surrogate substrate characterized by a resisitivity of at least 30 ohm-cm, an expansion coefficient less than the piezoelectric substrate, and a thermal conductivity for facilitating thermal diffusion;
• and
• a catalytic bonding film between the piezoelectric substrate and the surrogate substrate, the catalytic bonding film formed from a first bonding film deposited onto a surface of the piezoelectric substrate and a second bonding film of similar molecular structure to the first bonding film deposited onto a surface of the surrogate substrate, wherein the piezoelectric substrate is bonded to the surrogate substrate through a compressing of the first and second bonding films at a normal temperature while providing a compression force sufficient for bonding the piezoelectric substrate to the surrogate substrate.