Acoustic wave device, method for manufacturing acoustic wave device, and communication device
AssigneeKYOCERA Corporation
InventorYoshihide IKEGAMI
Life of this patent
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Abstract
Bonding strength between an electrode layer and an under bump metal can be ensured. An acoustic wave device includes a piezoelectric layer, an electrode layer located on an upper surface of the piezoelectric layer, an under bump metal, and a bump, in which the under bump metal includes a first region directly bonded to the piezoelectric layer and a second region bonded to the electrode layer, and at least part of the first region and at least part of the bump overlap each other when the piezoelectric layer is viewed in plan view.
Claims10
An acoustic wave device comprising:
- a piezoelectric layer;
- an electrode layer located on an upper surface of the piezoelectric layer;
- an under bump metal;
- and
- a bump, wherein
- the under bump metal comprises:
- a first region bonded to the piezoelectric layer;
- and
- a second region bonded to the electrode layer, and
- at least part of the first region and at least part of the bump overlap each other when the piezoelectric layer is viewed in plan view.
A method for manufacturing an acoustic wave device comprising:
- providing an electrically conductive layer on a piezoelectric layer;
- removing part of the electrically conductive layer to form an electrode layer in which an electrode is formed;
- forming an under bump metal in contact with the piezoelectric layer and an opening of the electrode layer;
- and
- forming a bump on the under bump metal.
Dependencies are inferred from the claim text.