Packaged acoustic wave devices with multilayer piezoelectric substrate
AssigneeSkyworks Solutions, Inc.
InventorsKeiichi Maki, Hironori Fukuhara, Rei Goto
Life of this patent
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Abstract
A surface acoustic wave package has a piezoelectric layer over a substrate and a thermally conductive structure attached to the substrate. The outer boundary of the piezoelectric layer is removed (e.g., etched) so that a resulting outer edge of the piezoelectric layer is spaced inward of an inner edge of the thermally conductive structure. The piezoelectric layer does not contact the thermally conductive structure to inhibit damage to the piezoelectric layer due to a stress differential between the substrate and the thermally conductive structure during a packaging process.
Claims21
A packaged acoustic wave component comprising:
- an acoustic wave device including a substrate, a piezoelectric layer disposed over at least a portion of the substrate and one or more signal lines;
- and
- a thermally conductive structure attached to one or both of the substrate and the one or more signal lines, the one or more signal lines interconnecting the piezoelectric layer and the thermally conductive structure, the thermally conductive structure being spaced from the piezoelectric layer so an outer edge of the piezoelectric layer is spaced inward of an inner surface of the thermally conductive structure.
A radio frequency module comprising:
- a package substrate;
- a packaged acoustic wave component including an acoustic wave device including a substrate, a piezoelectric layer disposed over at least a portion of the substrate and one or more signal lines, and a thermally conductive structure attached to one or both of the substrate and the one or more signal lines, the one or more signal lines interconnecting the piezoelectric layer and the thermally conductive structure, the thermally conductive structure being spaced from the piezoelectric layer so an outer edge of the piezoelectric layer is spaced inward of an inner surface of the thermally conductive structure;
- and
- additional circuitry, the packaged acoustic wave component and additional circuitry disposed on the package substrate.
A wireless communication device comprising:
- an antenna;
- and
- a front end module including one or more packaged acoustic wave components configured to filter a radio frequency signal associated with the antenna, each surface packaged acoustic wave component including an acoustic wave device including a substrate, a piezoelectric layer disposed over at least a portion of the substrate, and a thermally conductive structure attached to one or both of the substrate and one or more signal lines, the one or more signal lines interconnecting the piezoelectric layer and the thermally conductive structure, the thermally conductive structure being spaced from the piezoelectric layer so an outer edge of the piezoelectric layer is spaced inward of an inner surface of the thermally conductive structure.
Dependencies are inferred from the claim text.