H01S 5/02335
Up-side up mountings
Official title: Up-side up mountings, e.g. epi-side up mountings or junction up mountings
H01S5/02335 (Up-side up mountings) appears on 32 US grants and 52 published applications in this corpus.
Search patents in H01S- Granted patents
- 32
- Published applications
- 52
- Assignees
- 40
- Inventors
- 134
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 1 | 0 |
| 2018 | 2 | 4 |
| 2019 | 2 | 0 |
| 2020 | 0 | 3 |
| 2021 | 1 | 9 |
| 2022 | 2 | 11 |
| 2023 | 3 | 11 |
| 2024 | 7 | 3 |
| 2025 | 7 | 6 |
| 2026 | 7 | 3 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- VCSEL array with small pulse delay11 Aug 2026US 12,704,602 B2Western Digital Technologies, Inc.
- On-chip integration of optical components with photonic wire bonds and/or lenses16 Jun 2026US 12,658,668 B2The University of British Columbia
- VCSEL with self-aligned microlens to improve beam divergence5 May 2026US 12,620,779 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Laser device and laser projection apparatus10 Mar 2026US 12,573,811 B2Hisense Laser Display Co., Ltd
- Quantum cascade laser element, quantum cascade laser device, and method for manufacturing quantum cascade laser device10 Mar 2026US 12,573,813 B2Hamamatsu Photonics K.K.
- A vcsel with self-aligned microlens to improve beam divergence13 Aug 2026US 2026/0237971 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Optical apparatus and method for manufacturing optical apparatus23 Jul 2026US 2026/0213490 A1Sony Semiconductor Solutions Corporation
- Laser device and laser projection apparatus25 Jun 2026US 2026/0180282 A1Hisense Laser Display Co., Ltd
- Laser light source4 Dec 2025US 2025/0372942 A1Nichia Corporation
- Surface-emitting laser, light source device, and ranging device11 Sep 2025US 2025/0283979 A1Sony Group Corporation
Most cited
By later US patents
- Optoelectronic chip embedded organic substrate4US 10,043,787 B2International Business Machines Corporation · 2018
- Method for III-v/silicon hybrid integration3US 11,953,728 B2Rockley Photonics Limited · 2024
- Optoelectronic chip embedded organic substrate2US 10,418,351 B2International Business Machines Corporation · 2019
- Method and structure for manufacturable large area gallium and nitrogen containing substrate2US 10,903,623 B2Soraa Laser Diode, Inc. · 2021
- Semiconductor optical device, optical module, and method for manufacturing semiconductor optical device1US 10,181,699 B2Oclaro Japan, Inc. · 2019