H01S 5/0233
Mounting configuration of laser chips
H01S5/0233 (Mounting configuration of laser chips) appears on 2,104 US grants and 2,597 published applications in this corpus.
Search patents in H01S- Granted patents
- 2,104
- Published applications
- 2,597
- Assignees
- 631
- Inventors
- 3,939
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 7 | 0 |
| 1992 | 3 | 0 |
| 1993 | 7 | 0 |
| 1994 | 13 | 0 |
| 1995 | 15 | 0 |
| 1996 | 3 | 0 |
| 1997 | 13 | 0 |
| 1998 | 16 | 0 |
| 1999 | 25 | 0 |
| 2000 | 20 | 0 |
| 2001 | 18 | 15 |
| 2002 | 29 | 48 |
| 2003 | 31 | 70 |
| 2004 | 66 | 65 |
| 2005 | 44 | 66 |
| 2006 | 50 | 60 |
| 2007 | 35 | 79 |
| 2008 | 38 | 57 |
| 2009 | 50 | 62 |
| 2010 | 62 | 56 |
| 2011 | 45 | 53 |
| 2012 | 40 | 51 |
| 2013 | 39 | 55 |
| 2014 | 57 | 59 |
| 2015 | 67 | 78 |
| 2016 | 67 | 98 |
| 2017 | 91 | 98 |
| 2018 | 85 | 141 |
| 2019 | 137 | 150 |
| 2020 | 151 | 217 |
| 2021 | 135 | 201 |
| 2022 | 126 | 214 |
| 2023 | 135 | 213 |
| 2024 | 147 | 166 |
| 2025 | 112 | 148 |
| 2026 | 92 | 77 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
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- Semiconductor device25 Aug 2026US 12,719,232 B2Denso Corporation
- Laser package structure8 Oct 2026US 2026/0312367 A1iReach Corporation
- Laser package and method for producing same1 Oct 2026US 2026/0302721 A1ams-OSRAM International GmbH
- Optoelectronic semiconductor component and production method24 Sep 2026US 2026/0291166 A1ams-OSRAM International GmbH
- 3d package for semiconductor thermal management17 Sep 2026US 2026/0273956 A1Genesee Valley Innovations, LLC
- Method for producing an optoelectronic component, and optoelectronic component17 Sep 2026US 2026/0282625 A1ams-OSRAM International GmbH
Most cited
By later US patents
- Optical coupling structures and the fabrication processes197US 6,684,007 B2Fujitsu Limited · 2004
- Method of making a mechanically compliant bump164US 6,458,411 B1Aralight, Inc. · 2002
- Methods for fabricating components with precise dimension control151US 8,288,204 B1Western Digital (Fremont), LLC · 2012
- Laser assisted transfer welding process144US 9,161,448 B2Semprius, Inc. · 2015
- Multiple wavelengths semiconductor laser device131US 7,483,468 B2Kabushiki Kaisha Toshiba · 2009