H01S 5/0234
Up-side down mountings
Official title: Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
H01S5/0234 (Up-side down mountings) appears on 691 US grants and 866 published applications in this corpus.
Search patents in H01S- Granted patents
- 691
- Published applications
- 866
- Assignees
- 275
- Inventors
- 1,544
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 8 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 10 | 0 |
| 1999 | 12 | 0 |
| 2000 | 7 | 0 |
| 2001 | 10 | 9 |
| 2002 | 15 | 17 |
| 2003 | 10 | 27 |
| 2004 | 28 | 32 |
| 2005 | 15 | 29 |
| 2006 | 21 | 29 |
| 2007 | 17 | 28 |
| 2008 | 15 | 27 |
| 2009 | 18 | 27 |
| 2010 | 31 | 28 |
| 2011 | 18 | 25 |
| 2012 | 17 | 17 |
| 2013 | 17 | 15 |
| 2014 | 15 | 16 |
| 2015 | 17 | 24 |
| 2016 | 18 | 27 |
| 2017 | 35 | 32 |
| 2018 | 26 | 35 |
| 2019 | 42 | 38 |
| 2020 | 34 | 63 |
| 2021 | 39 | 60 |
| 2022 | 35 | 62 |
| 2023 | 37 | 77 |
| 2024 | 42 | 57 |
| 2025 | 24 | 42 |
| 2026 | 36 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor laser device15 Sep 2026US 12,738,709 B2Ushio Denki Kabushiki Kaisha
- Optical semiconductor device, optical unit, and method for manufacturing optical unit25 Aug 2026US 12,719,237 B2Hamamatsu Photonics K.K.
- Tunable hybrid III-V/IV laser sensor system-on-a chip for real-time monitoring of a blood constituent concentration level18 Aug 2026US 12,708,293 B2Brolis Sensor Technology, UAB et al.
- Surface emitting laser device, electronic device, and manufacturing method for surface emitting laser device11 Aug 2026US 12,706,436 B2Sony Semiconductor Solutions Corporation
- Substrate for facilitating one or more interconnections of an opto-electrical device11 Aug 2026US 12,706,437 B2Lumentum Operations LLC
- Optoelectronic semiconductor component20 Aug 2026US 2026/0246233 A1ams-OSRAM International GmbH
- Flip chip tunable vcsel with hcg on si submount13 Aug 2026US 2026/0237970 A1Bandwidth10, LTD.
- Nitride-based semiconductor light-emitting element and manufacturing method thereof13 Aug 2026US 2026/0239778 A1Nuvoton Technology Corporation Japan
- Semiconductor light-emitting device13 Aug 2026US 2026/0239804 A1Hamamatsu Photonics K.K.
- Electronic device6 Aug 2026US 2026/0229838 A1Sony Semiconductor Solutions Corporation
Most cited
By later US patents
- Method of making a mechanically compliant bump164US 6,458,411 B1Aralight, Inc. · 2002
- Multiple wavelengths semiconductor laser device131US 7,483,468 B2Kabushiki Kaisha Toshiba · 2009
- Semiconductor light emitting device123US 5,627,851 ARicoh Company, Ltd. · 1997
- Method of manufacture for an ultraviolet laser diode116US 9,246,311 B1Soraa Laser Diode, Inc. · 2016
- Epitaxial Wurtzite growth structure for semiconductor light-emitting device113US 5,006,908 ANippon Telegraph and Telephone Corporation · 1991