Surface emitting laser device, electronic device, and manufacturing method for surface emitting laser device

An electronic device, comprising:

• a surface emitting laser device that includes:
• an element unit including:
• an element arrangement area that includes a plurality of surface emitting laser elements, and
• an adjacent area adjacent to the element arrangement area;
• a driver unit including a driver IC;
• a plurality of first bumps, wherein each first bump of the plurality of first bumps joins the driver unit to a respective surface emitting laser element of the plurality of surface emitting laser elements;
• and
• a plurality of second bumps that joins the driver unit to the adjacent area, wherein
• each first bump of the plurality of first bumps and each second bump of the plurality of second bumps include a conductive material,
• the conductive material shifts from a softened state to a cured state by pressurization,
• an arrangement density of the plurality of second bumps is higher than an arrangement density of the plurality of first bumps, and
• an interval between two adjacent second bumps of the plurality of second bumps is less than an interval between two adjacent first bumps of the plurality of first bumps.

A manufacturing method of a surface emitting laser device, the manufacturing method comprising:

• joining a driver unit to each surface emitting laser element of plurality of surface emitting laser elements via a respective first bump of a plurality of first bumps, wherein
• the surface emitting laser device includes:
• the driver unit;
• and
• an element unit including:
• an element arrangement area, and
• an adjacent area adjacent to the element arrangement area,
• the element arrangement area includes the plurality of surface emitting laser elements, and
• the driver unit includes a driver IC;
• and
• joining the driver unit to the adjacent area via a plurality of second bumps, wherein
• each first bump of the plurality of first bumps and each second bump of the plurality of second bumps include a conductive material,
• the conductive material shifts from a softened state to a cured state by pressurization,
• an arrangement density of the plurality of second bumps is higher than an arrangement density of the plurality of first bumps, and
• an interval between two adjacent second bumps of the plurality of second bumps is less than an interval between two adjacent first bumps of the plurality of first bumps.