Method for producing an optoelectronic component, and optoelectronic component

An optoelectronic component

• comprising a transparent substrate having a back side,
• wherein a grid having walls consisting of an electrically conductive material is formed on the back side of the substrate, cells of the grid being formed between the walls,
• wherein a wavelength-converting material is arranged in at least one cell of the grid,
• wherein optoelectronic semiconductor chips are arranged over the cells of the grid,
• wherein each optoelectronic semiconductor chip comprises a front side and a back side,
• wherein the front sides of the optoelectronic semiconductor chips are oriented toward the back side of the substrate,
• wherein the optoelectronic semiconductor chips are electrically conductively connected to the grid,
• wherein a filler material is arranged on the back side of the substrate, wherein the optoelectronic semiconductor chips are embedded in the filler material in such a way that the back sides of the optoelectronic semiconductor chips are not covered by the filler material,
• wherein side faces of the optoelectronic semiconductor chips that extend between the front sides and the back sides of the optoelectronic semiconductor chips are covered by the filler material,
• wherein a driver chip is arranged over the back sides of the optoelectronic semiconductor chips,
• wherein the optoelectronic semiconductor chips are electrically conductively connected to the driver chip.