Laser package structure

A package structure of a laser device, comprising:

• a first light transmissive substrate comprising a first surface, a second surface opposing the first surface, a first side surface between the first surface and the second surface, and a second side surface opposing the first side surface;
• a laser structure comprising a first laser chip and a second laser chip which are on the first surface, and the first laser chip comprising a third side surface;
• wherein the first laser chip comprises a first lower surface away from the second surface, a first electrode and a second electrode on the first lower surface;
• wherein the second laser chip comprises a second lower surface away from the second surface, a first electrode and a second electrode on the second lower surface;
• and
• wherein the first electrode of the second laser chip extends into the second laser chip, and the second electrode of the first laser chip extends into the first laser chip.