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US 10,418,351 B2Granted
Optoelectronic chip embedded organic substrate
AssigneeInternational Business Machines Corporation
InventorMasao Tokunari
Life of this patent
Estimating the term…
Abstract
Optoelectronic devices and method of forming the same include an optoelectronic component in a substrate layer. An integrated circuit chip is positioned on the substrate layer. A lens is positioned on the substrate layer directly above the optoelectronic component and above at least part of the integrated circuit chip. The lens has a cut-out portion that accommodates the integrated circuit chip.
Claims18
An optoelectronic device, comprising:
- an optoelectronic component in a substrate layer;
- an integrated circuit chip positioned on the substrate layer;
- and
- a lens positioned on the substrate layer directly above the optoelectronic component and above at least part of the integrated circuit chip, wherein the lens has a cut-out portion that accommodates the integrated circuit chip.
1 more element
A method of forming an optoelectronic device, comprising:
- removing material in a substrate layer to form a cavity;
- positioning an optoelectronic component in the cavity;
- positioning an integrated circuit chip on the substrate layer in electrical communication with the optoelectronic component;
- and
- positioning a lens on the substrate layer above the optoelectronic component and above at least part of the integrated circuit chip, the lens having a cut-out portion that accommodates the integrated circuit chip.
2 more elements
Dependencies are inferred from the claim text.