Method for III-v/silicon hybrid integration
AssigneeRockley Photonics Limited
InventorsGuomin Yu, Mohamad Dernaika, Ludovic Caro, Hua Yang, Aaron John Zilkie
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Abstract
A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region.
Claims20
An optoelectronic device comprising:
- a precursor photonic device comprising:
- a substrate;
- a bonding region, for receiving and bonding to a transfer die;
- and
- a plurality of alignment marks, for use in transfer printing, said alignment marks being located in or adjacent to the bonding region, wherein the plurality of alignment marks comprise two or more different types of alignment marks.
An optoelectronic device comprising:
- a precursor photonic device comprising:
- a substrate;
- a bonding region, for receiving and bonding to a transfer die;
- and
- a plurality of alignment marks, for use in transfer printing, said alignment marks being located in or adjacent to the bonding region,
- wherein the alignment marks allow for alignment in at least two non-parallel directions, the two non-parallel directions being parallel to the bonding region.
An optoelectronic device comprising:
- a precursor photonic device comprising:
- a substrate;
- a bonding region, for receiving and bonding to a transfer die;
- and
- a plurality of alignment marks, for use in transfer printing, said alignment marks being located in or adjacent to the bonding region,
- wherein the optoelectronic device further comprises a transfer die comprising a photonic device, said photonic device having a bonding surface suitable for bonding to a precursor photonic device,
- wherein the transfer die includes a plurality of alignment marks, for use in a transfer-print process, wherein each of the plurality of alignment marks of the transfer die is selected from two or more different types of alignment marks, and
- wherein the alignment marks of the transfer die are voids in the transfer die which extend entirely through the transfer die.
Dependencies are inferred from the claim text.