Optoelectronic chip embedded organic substrate
AssigneeInternational Business Machines Corporation
InventorMasao Tokunari
Life of this patent
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Abstract
Optoelectronic devices and method of forming the same include an optoelectronic chip in a substrate layer, the optoelectronic chip having one or more optoelectronic components. An integrated circuit chip is positioned on the substrate layer. A lens array is positioned on the substrate layer above the optoelectronic chip and above at least part of the integrated circuit chip. The lens array includes one or more lens positioned directly respective optoelectronic components.
Claims19
An optoelectronic device, comprising:
- an optoelectronic chip in a substrate layer, the optoelectronic chip comprising one or more optoelectronic components;
- an integrated circuit chip positioned on the substrate layer;
- and
- a lens array positioned on the substrate layer above the optoelectronic chip and above at least part of the integrated circuit chip, wherein the lens array comprises one or more lenses positioned directly above said optoelectronic chip and has a cut-out portion that accommodates the integrated circuit chip.
A method of forming an optoelectronic device, comprising:
- removing material in a substrate layer to form a cavity;
- positioning an optoelectronic chip in the cavity;
- positioning an integrated circuit chip on the substrate layer in electrical communication with the optoelectronic chip;
- and
- positioning a lens array on the substrate layer above the optoelectronic chip and above at least part of the integrated circuit chip, the lens array having a cut-out portion that accommodates the integrated circuit chip.
A method of forming an optoelectronic device, comprising:
- ablating material in a substrate layer to form a plurality of cavities using a laser that stops on one or more conductive wire layers embedded in the substrate layer;
- positioning an optoelectronic chip in one of the plurality of cavities;
- positioning an integrated circuit chip on the substrate layer in electrical communication with the optoelectronic chip;
- positioning a lens array on the substrate layer above the optoelectronic chip and above at least part of the integrated circuit chip by aligning the lens array with one or more cavities of the plurality of cavities, such that at least a portion of the lens array is positioned within the substrate layer, the lens array having a cut-out portion that accommodates the integrated circuit chip.
Dependencies are inferred from the claim text.