On-chip integration of optical components with photonic wire bonds and/or lenses

A method for fabricating a semiconductor chip with an integrated laser diode, the method comprising:

• providing a semiconductor chip comprising optical and electrical components;
• fabricating a recess in the semiconductor chip by removing material from a portion of a thickness of the semiconductor chip, the recess shaped to receive the laser diode;
• metallizing at least one surface of the recess by depositing metal into the recess;
• placing the laser diode into the recess and, when the laser diode is in the recess, electrically coupling the laser diode to the at least one metallized surface of the recess, the laser diode comprising a p-type semiconductor and an n-type semiconductor, the n-type semiconductor electrically coupled to the at least one metallized surface of the recess;
• and
• optically coupling an optical output of the laser diode to an optical input of a photonic interface of the chip with a photonic wire bond.