Laser device and laser projection apparatus

A laser device, comprising:

• a bottom plate;
• a frame body being disposed on the bottom plate, the frame body and the bottom plate forming an accommodating space;
• a heat sink being located on the bottom plate and in the accommodating space;
• and
• a light-emitting chip being located on a surface of the heat sink away from the bottom plate and being located in the accommodating space;
• wherein the light-emitting chip includes a first electrode, a light-emitting layer and a second electrode that are sequentially stacked in a direction away from the bottom plate;
• the light-emitting layer includes a plurality of micro-particles that are a plurality of protrusions and/or a plurality of depressions, and the plurality of protrusions and/or the plurality of depressions are located on a surface of the light-emitting layer proximate to the bottom plate;
• the first electrode includes a plurality of first protrusions and/or a plurality of first depressions, the plurality of first protrusions correspond to the plurality of protrusions in the light-emitting layer, and the plurality of first depressions correspond to the plurality of depressions in the light-emitting layer;
• the plurality of first protrusions and/or the plurality of first depressions are located on a first surface of the light-emitting chip, the first surface is fixed to the heat sink;
• the heat sink includes a heat dissipation substrate, a conductive layer and a solder layer that are sequentially stacked in the direction away from the bottom plate, and the solder layer is configured to solder the light-emitting chip;
• and
• after the heat sink and the light-emitting chip are soldered, the solder layer that is melted is configured to be in full contact with a first surface of the first electrode in contact with the heat sink in the light-emitting chip, and to fill the plurality of first depressions in the first surface of the first electrode.