H01S 2301/173

The laser chip comprising special buffer layers

Official title: The laser chip comprising special buffer layers, e.g. dislocation prevention or reduction

H01S2301/173 (The laser chip comprising special buffer layers) appears on 476 US grants and 518 published applications in this corpus.

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Granted patents
476
Published applications
518
Assignees
182
Inventors
938
Latest grant
25 Aug 2026

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H01S 2301/173: granted patents and published applications per publication year
YearGranted patentsPublished applications
198410
198500
198600
198700
198810
198910
199000
199110
199210
199320
199410
199510
199610
199710
1998100
199950
2000130
2001154
2002615
20031055
20042935
20052453
20063625
20072227
20082423
20092029
20102824
20111929
20122016
20132116
20141610
2015169
20161310
20171414
20181310
20191714
20201117
20211215
20221222
20231217
20241013
2025136
2026410

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