H01J 37/3494
Adaptation to extreme pressure conditions
Official title: {Adaptation to extreme pressure conditions}
H01J37/3494 (Adaptation to extreme pressure conditions) appears on 20 US grants and 4 published applications in this corpus.
Search patents in H01J- Granted patents
- 20
- Published applications
- 4
- Assignees
- 12
- Inventors
- 39
- Latest grant
- 2 Jun 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Plasma generation apparatus2 Jun 2020US 10,674,592 B2Electronics and Telecommunications Research Institute
- Collimated deposition apparatus18 Feb 2003US 6,521,106 B1Novellus Systems, Inc.
- Sputtering method and apparatus for depositing a coating onto substrate23 Jul 2002US 6,423,191 B1Thin Films, Ltd.
- Magnetron for low pressure, full face erosion8 May 2001US 6,228,235 B1APPLIED Materials.Inc.
- Magnetron for low pressure full face erosion25 May 1999US 5,907,220 AAPPLIED Materials.Inc.
- Plasma generation apparatus2 Apr 2020US 2020/0107430 A1Electronics and Telecommunications Research Institute
- Apparatus for vacuum sputter deposition and method therefor26 Jul 2018US 2018/0211823 A1APPLIED Materials.Inc.
- Systems and methods for high and ultra-high vacuum physical vapor deposition with in-situ magnetic field7 May 2015US 2015/0125622 A1The Trustees of Columbia University in HIe City of
- Sputtering method and apparatus for depositing a coating onto substrate17 Oct 2002US 2002/0148941 A1
Most cited
By later US patents
- Rotating sputtering apparatus for selected erosion118US 5,252,194 AVarian Associates, Inc. · 1993
- Magnetron sputtering source for low pressure operation86US 5,593,551 AVarian Associates, Inc. · 1997
- Collimated deposition apparatus and method75US 5,330,628 AVarian Associates, Inc. · 1994
- Planar magnetron sputtering device48US 4,180,450 AVac-Tec Systems, Inc. · 1979
- Low pressure reactive magnetron sputtering apparatus and method45US 5,525,199 AOptical Corporation of America · 1996