Collimated deposition apparatus and method
AssigneeVarian Associates, Inc.
InventorsR. Ernest Demaray, Vance E. Hoffman, John C. Helmer, Young H. Park, Ronald R. Cochran
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AssigneeVarian Associates, Inc.
InventorsR. Ernest Demaray, Vance E. Hoffman, John C. Helmer, Young H. Park, Ronald R. Cochran
Estimating the term…
Sputtering apparatus and method which are particularly suitable for forming step coatings. A workpiece is supported in a chamber, particles are emitted from a sputter source in a substantially uniform manner throughout an area of greater lateral extent than the workpiece, the pressure within the chamber is maintained at a level which is sufficiently low to prevent substantial scattering of the particles between the source and the workpiece, and the particles are passed through a collimating filter having a plurality of transmissive cells with a length to diameter ratio on the order of 1:1 to 3:1 positioned between the source and the workpiece to limit the angles at which the particles can impinge upon the workpiece.
Sputtering apparatus for depositing a step coating on a workpiece comprising:
A method of depositing a step coating on a workpiece, comprising the steps
A method of depositing a step coating on a workpiece, comprising the steps
A method of depositing a step coating on a workpiece, comprising the steps of:
An apparatus for sputter etching and sputter coating a workpiece comprising:
Sputtering apparatus for depositing a step coating in an opening in a workpiece, said opening having an aspect ratio comprising:
A method of depositing a step coating in an opening in a workpiece having an aspect ratio which changes as the coating builds up therein, comprising the steps of:
A method of depositing a step coating in an opening in a workpiece having an aspect ratio which changes as the coating builds up therein, comprising the steps of:
Dependencies are inferred from the claim text.