Planar magnetron sputtering device
AssigneeVac-Tec Systems, Inc.
InventorCharles F. Morrison, Jr.
Life of this patent
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AssigneeVac-Tec Systems, Inc.
InventorCharles F. Morrison, Jr.
Estimating the term…
In a planar magnetron sputtering device including a cathode of target material having a planar sputtering surface, at least a portion of which is disposed about a center line perpendicular to said surface, an anode adapted for establishing an accelerating electric field between the anode and cathode, and magnetic means for establishing a magnetic field adjacent the planar sputtering surface of the cathode for lengthening the path traveled by electrons removed from said cathode, and wherein the lines of force of the magnetic field extend over the sputtering surface of said cathode and pass through the cathode in the vicinity of the center line, the improvement where the magnetic means includes first magnet means for causing a majority of the magnetic lines of force to pass through the cathode in the vicinity of the center line at angles of 45.degree. or less with respect to its planar sputtering surface to thereby enhance the uniformity of cathode erosion and where the magnetic means includes further magnet means for causing the magnetic lines of force to be substantially perpendicular to the sputtering surface of the cathode at its approximate periphery.
In a planar magnetron sputtering device including a cathode of target material having a planar sputtering surface, at least a portion of which is disposed about a center line perpendicular to said surface, an anode adapted for establishing an accelerating electric field between said anode and cathode, and magnetic means for establishing a magnetic field adjacent the planar sputtering surface of said cathode for lengthening the path traveled by electrons removed from said cathode, and wherein the lines of force of the magnetic field extend over the sputtering surface of said cathode and pass through the cathode in the vicinity of said center line,
In a planar magnetron sputtering device including a cathode of target material having a planar sputtering surface, at least a portion of which is disposed about a center line perpendicular to said surface, an anode adapted for establishing an accelerating electric field between said anode and cathode, and magnetic means for establishing a magnetic field adjacent the planar sputtering surface of said cathode for lengthening the path traveled by electrons removed from said cathode, and wherein the lines of force of the magnetic field extend over the sputtering surface of said cathode and pass through the cathode in the vicinity of said center line,
In a planar magnetron sputtering device including a cathode of target material having a planar sputtering surface, at least a portion of which is disposed about a center line perpendicular to said surface, an anode adapted for establishing an accelerating electric field between said anode and cathode, and magnetic means for establishing a magnetic field adjacent the planar sputtering surface of said cathode for lengthening the path traveled by electrons removed from said cathode, and wherein the lines of force of the magnetic field extend over the sputtering surface of said cathode and pass through the cathode in the vicinity of said center line,
Dependencies are inferred from the claim text.