H01J 37/32688
Multi-cusp fields
Official title: {Multi-cusp fields}
H01J37/32688 (Multi-cusp fields) appears on 112 US grants and 55 published applications in this corpus.
Search patents in H01J- Granted patents
- 112
- Published applications
- 55
- Assignees
- 56
- Inventors
- 225
- Latest grant
- 16 Jan 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 6 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 6 | 0 |
| 2000 | 8 | 0 |
| 2001 | 10 | 4 |
| 2002 | 8 | 5 |
| 2003 | 4 | 4 |
| 2004 | 4 | 6 |
| 2005 | 1 | 5 |
| 2006 | 1 | 3 |
| 2007 | 1 | 3 |
| 2008 | 4 | 1 |
| 2009 | 1 | 1 |
| 2010 | 2 | 2 |
| 2011 | 4 | 3 |
| 2012 | 0 | 1 |
| 2013 | 1 | 4 |
| 2014 | 2 | 0 |
| 2015 | 1 | 1 |
| 2016 | 2 | 4 |
| 2017 | 0 | 0 |
| 2018 | 1 | 2 |
| 2019 | 0 | 1 |
| 2020 | 2 | 1 |
| 2021 | 3 | 2 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 1 | 1 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method and apparatus for depositing a material16 Jan 2024US 11,875,980 B2
- Plasma processing apparatus20 Sep 2022US 11,450,515 B2Tokyo Electron Limited
- Magnetically enhanced high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond-like films23 Mar 2021US 10,957,519 B2IonQuest Corp.
- Copper plasma etching method and manufacturing method of display panel2 Feb 2021US 10,910,232 B2Korea University Research and Business Foundation, Sejong Campus
- Method and apparatus for depositing a material26 Jan 2021US 10,900,114 B2
- Heterogeous negative ion source based upon hydrogen plasma9 Oct 2025US 2025/0316448 A1APPLIED Materials.Inc.
- Method and devices for plasma treatment4 Jul 2024US 2024/0222088 A1
- Method and Apparatus for Depositing a Material29 Apr 2021US 2021/0123130 A1
- Plasma processing apparatus14 Jan 2021US 2021/0013015 A1Tokyo Electron Limited
- High-efficiency ion discharge method and apparatus5 Mar 2020US 2020/0072200 A1The Regents of the University of California
Most cited
By later US patents
- Vacuum processing chamber having multi-mode access485US 6,095,083 AApplied Materiels, Inc. · 2000
- High density plasma deposition and etching apparatus266US 4,990,229 APlasma & Materials Technologies, Inc. · 1991
- Multi-electrode plasma processing apparatus262US 5,464,499 ATexas Instruments Incorporated · 1995
- Silicon scavenger in an inductively coupled RF plasma reactor249US 5,556,501 AAPPLIED Materials.Inc. · 1996
- High density plasma deposition and etching apparatus208US 5,122,251 APlasma & Materials Technologies, Inc. · 1992