H01J 37/3255
Material
Official title: {Material}
H01J37/3255 (Material) appears on 281 US grants and 366 published applications in this corpus.
Search patents in H01J- Granted patents
- 281
- Published applications
- 366
- Assignees
- 141
- Inventors
- 836
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 3 |
| 2003 | 0 | 3 |
| 2004 | 2 | 7 |
| 2005 | 1 | 3 |
| 2006 | 1 | 3 |
| 2007 | 4 | 9 |
| 2008 | 3 | 13 |
| 2009 | 8 | 14 |
| 2010 | 5 | 19 |
| 2011 | 8 | 18 |
| 2012 | 8 | 9 |
| 2013 | 6 | 9 |
| 2014 | 11 | 13 |
| 2015 | 8 | 14 |
| 2016 | 17 | 17 |
| 2017 | 11 | 16 |
| 2018 | 14 | 17 |
| 2019 | 23 | 27 |
| 2020 | 19 | 31 |
| 2021 | 18 | 24 |
| 2022 | 19 | 27 |
| 2023 | 24 | 22 |
| 2024 | 15 | 22 |
| 2025 | 23 | 18 |
| 2026 | 11 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for forming semiconductor device structure18 Aug 2026US 12,712,158 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Etching method and plasma processing apparatus21 Jul 2026US 12,689,006 B2Tokyo Electron Limited
- Methods and apparatus for processing a substrate14 Jul 2026US 12,685,050 B2APPLIED Materials.Inc.
- Plasma processing apparatus16 Jun 2026US 12,658,411 B2Tokyo Electron Limited
- Substrate treating apparatus12 May 2026US 12,626,890 B2Semes Co., Ltd.
- Plasma processing apparatus17 Sep 2026US 2026/0279738 A1Tokyo Electron Limited
- Processing apparatus and processing method25 Jun 2026US 2026/0179882 A1Tokyo Electron Limited
- Plasma generator and substrate processing apparatus including the same11 Jun 2026US 2026/0162936 A1Samsung Electronics Co., Ltd.
- Electromagnetic pulse apparatus, system, and method11 Jun 2026US 2026/0164530 A1Lake Effect Consortium, LLC
- Method and apparatus to reduce feature charging in plasma processing chamber14 May 2026US 2026/0135066 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Showerhead electrode with centering feature436US 8,402,918 B2Lam Research Corporation · 2013
- Method for depositing metals free ald silicon nitride films using halide-based precursors346US 9,824,884 B1Lam Research Corporation · 2017
- Composite electrode for plasma processes322US 5,074,456 ALam Research Corporation · 1991
- Systems and methods for internal surface conditioning in plasma processing equipment149US 9,355,922 B2APPLIED Materials.Inc. · 2016
- Grooved insulator to reduce leakage current123US 9,659,753 B2APPLIED Materials.Inc. · 2017