Processing apparatus and processing method
AssigneeTokyo Electron Limited
InventorsTakuya SUZUKI, Yuji AOTA, Hiroto ITO, Koji MARUYAMA
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AssigneeTokyo Electron Limited
InventorsTakuya SUZUKI, Yuji AOTA, Hiroto ITO, Koji MARUYAMA
Estimating the term…
A processing apparatus includes a first member, a second member, an ERG (Electro-Rheological Gel) sheet disposed between the first member and the second member, and control circuitry. The ERG sheet includes an ERG layer, a plurality of electrode pairs each having two electrodes, and a substrate on which the plurality of electrode pairs are disposed. The control circuitry is configured to control the thermal conductivity of the ERG layer, for each of the plurality of electrode pairs, by independently controlling voltages applied to each of the plurality of electrode pairs such that a temperature distribution of the first member or the second member becomes a predetermined temperature distribution due to heat exchange between the first member and the second member.
A processing apparatus, comprising:
A processing method in a processing apparatus including a first member, a second member, an ERG (Electro-Adhesive Gel) sheet disposed between the first member and the second member, a processing container that performs processing on a wafer using plasma generated inside, and control circuitry, wherein the ERG sheet includes an ERG layer, a plurality of electrode pairs each having two electrodes, and a substrate on which the plurality of electrode pairs are disposed, the processing method comprising:
A processing apparatus, comprising:
Dependencies are inferred from the claim text.