H01J 37/32467
Material
Official title: {Material}
H01J37/32467 (Material) appears on 274 US grants and 406 published applications in this corpus.
Search patents in H01J- Granted patents
- 274
- Published applications
- 406
- Assignees
- 131
- Inventors
- 993
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 16 | 0 |
| 2001 | 6 | 3 |
| 2002 | 7 | 11 |
| 2003 | 12 | 6 |
| 2004 | 8 | 8 |
| 2005 | 2 | 5 |
| 2006 | 2 | 4 |
| 2007 | 2 | 9 |
| 2008 | 1 | 15 |
| 2009 | 5 | 5 |
| 2010 | 7 | 12 |
| 2011 | 4 | 9 |
| 2012 | 6 | 9 |
| 2013 | 4 | 8 |
| 2014 | 8 | 5 |
| 2015 | 8 | 21 |
| 2016 | 10 | 21 |
| 2017 | 17 | 20 |
| 2018 | 6 | 21 |
| 2019 | 22 | 25 |
| 2020 | 20 | 31 |
| 2021 | 20 | 28 |
| 2022 | 19 | 27 |
| 2023 | 15 | 17 |
| 2024 | 17 | 25 |
| 2025 | 14 | 28 |
| 2026 | 7 | 33 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structural member21 Jul 2026US 12,689,007 B2Toto Ltd.
- Protection treatments for surfaces of semiconductor fabrication equipment21 Apr 2026US 12,609,286 B2APPLIED Materials.Inc.
- Plasma showerhead assembly and method of reducing defects17 Mar 2026US 12,580,159 B2APPLIED Materials.Inc.
- Protective liner for plasma source10 Mar 2026US 12,573,594 B2APPLIED Materials.Inc.
- Polymeric coating for semiconductor processing chamber components10 Feb 2026US 12,548,737 B2Lam Research Corporation
- Device for reducing a parasitic plasma and a substrate processing apparatus having the same8 Oct 2026US 2026/0311971 A1ASM IP Holding B. V.
- Shadow ring for substrate bond protection in plasma etch chamber17 Sep 2026US 2026/0279739 A1APPLIED Materials.Inc.
- Edge ring for semiconductor manufacturing apparatus and manufacturing method therefor10 Sep 2026US 2026/0269192 A1Tokai Carbon Korea Co., Ltd
- Electrostatic chuck assembly3 Sep 2026US 2026/0260850 A1NGK Corporation
- Plasma processing apparatus, method of manufacturing electrode plate, and method of regenerating electrode plate3 Sep 2026US 2026/0260851 A1Tokyo Electron Limited
Most cited
By later US patents
- Parallel plate electrode plasma reactor having an inductive antenna and adjustable radial distribution of plasma ion density523US 6,054,013 AAPPLIED Materials.Inc. · 2000
- Vacuum processing chamber having multi-mode access485US 6,095,083 AApplied Materiels, Inc. · 2000
- Systems, methods and apparatus for choked flow element extraction472US 9,449,793 B2Lam Research Corporation · 2016
- Method and apparatus for producing uniform process rates381US 6,320,320 B1Lam Research Corporation · 2001
- Object-processing apparatus controlling production of particles in electric field or magnetic field380US 8,051,799 B2Renesas Electronics Corporation · 2011